1 July 2011 Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects
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Abstract
In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.
© (2011) Society of Photo-Optical Instrumentation Engineers (SPIE)
Ikechi A. Ukaegbu, Ikechi A. Ukaegbu, Jamshid Sangirov, Jamshid Sangirov, Mu Hee Cho, Mu Hee Cho, Tae-Woo Lee, Tae-Woo Lee, Hyo-Hoon Park, Hyo-Hoon Park, } "Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects," Optical Engineering 50(7), 075401 (1 July 2011). https://doi.org/10.1117/1.3600768 . Submission:
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