1 November 2012 Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects
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Abstract
The development of a 4-channel×10-Gbits/s optical interconnect module based on a silicon optical bench (SiOB) is presented. The 4-channel vertical-cavity surface-emitting laser (VCSEL) and photo diode (PD) arrays are flip-chip assembled onto the pedestals of SiOB using Au/Sn solder bumps to form an SiOB-based bi-directional optical sub-assembly (BOSA) configuration. The optical coupling of VCSEL-to-multi-mode fiber (MMF) and MMF-to-PD without adding coupled optics is -5.2 and -2 dB, respectively. The wide alignment tolerances of 1-dB power variation for the transmitting and receiver parts to be ±15 μm are achieved. The clearly open 10-Gbits/s eye patterns of transmitting part as well as the 10-12-order bit error rate (BER) at the receiving part verify the proposed SiOB-based module is suitable for the application of 4-channel×10-Gbits/s optical interconnects.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Chin-Ta Chen, Hsu-Liang Hsiao, Po-Kuan Shen, Guan-Fu Lu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Jen-Yu Li, Ajay Nedle, Shou-Fu Chang, Yo-Shen Lin, Mount-Learn Wu, "Miniaturized bidirectional optical subassembly using silicon optical bench with 45-deg micro-reflectors in short-reach 40-Gbit/s optical interconnects," Optical Engineering 51(11), 115005 (1 November 2012). https://doi.org/10.1117/1.OE.51.11.115005 . Submission:
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