6 April 2012 Dual-prism coupler for board-level free-space optical interconnects: design and simulations
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Abstract
An optical design for coupling light from off-chip lasers to on-chip surface-normal modulators is proposed in order to implement chip-to-chip free-space optical interconnects. The method uses a dual-prism module constructed from prisms made of two different glasses. The various alignment tolerances of the proposed system were investigated. For the off-chip lasers, vertical cavity surface emitting lasers (VCSEL) are proposed. The rationale behind using on-chip modulators rather than VCSELs is to avoid VCSEL thermal loads on the chip, and because of higher reliability of modulators than VCSELs. Particularly above 10  Gbit/sec (Gbit/sec⁡), an empirical model shows rapid decrease of VCSEL median time to failure vs. data rate. Thus the proposed interconnect scheme which utilizes continuous wave VCSELs that are externally modulated by on-chip multiple quantum well modulators is applicable for chip-to-chip optical interconnects at 20Gbit/sec⁡ and higher line data rates.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Rohit Nair, Keith W. Goossen, Michael W. Haney, "Dual-prism coupler for board-level free-space optical interconnects: design and simulations," Optical Engineering 51(4), 045401 (6 April 2012). https://doi.org/10.1117/1.OE.51.4.045401 . Submission:
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