25 July 2012 Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board
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Abstract
We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70×8×0.25  mm. The completed active module has features of thinness (0.5 mm), small size (7×5  mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Sung Hwan Hwang, Woo-Jin Lee, Myoung Jin Kim, Eun Joo Jung, Gye Won Kim, Jong Bae An, Byung Sup Rho, Ki Young Jung, Kyung Soon Cha, "Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board," Optical Engineering 51(7), 075402 (25 July 2012). https://doi.org/10.1117/1.OE.51.7.075402 . Submission:
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