25 July 2012 Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board
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Abstract
We describe an ultra-thin and low-power optical interconnect module for mobile electronic devices such as mobile phones and notebooks. The module was fabricated by directly packaging optic and electronic components onto a thin and flexible optical printed circuit board having a size of 70×8×0.25  mm. The completed active module has features of thinness (0.5 mm), small size (7×5  mm), very low total power consumption (15.88 mW), and high data rate transmissions (2.5 Gbps).
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Sung Hwan Hwang, Sung Hwan Hwang, Woo-Jin Lee, Woo-Jin Lee, Myoung Jin Kim, Myoung Jin Kim, Eun Joo Jung, Eun Joo Jung, Gye Won Kim, Gye Won Kim, Jong Bae An, Jong Bae An, Byung Sup Rho, Byung Sup Rho, Ki Young Jung, Ki Young Jung, Kyung Soon Cha, Kyung Soon Cha, } "Ultra-thin and low-power optical interconnect module based on a flexible optical printed circuit board," Optical Engineering 51(7), 075402 (25 July 2012). https://doi.org/10.1117/1.OE.51.7.075402 . Submission:
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