2 August 2012 Mitigation of surface damage growth by hydrofluoric acid etching combined with carbon dioxide laser treatment
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Abstract
Damage sites as large as 600 μm in fused silica surface were successfully mitigated with a new protocol by hydrofluoric acid (HF) etching combined with carbon dioxide laser treatment. The damage sites were first etched in 40% HF solution to blunt the fractures, and then the etched damage sites were smoothed with a CO2 laser. It has been found that the etching rate of damaged material in the lateral direction is larger than in the longitudinal direction; thus, an optimized etching time was chosen to etch the damage sites based on the etching ratio. Three types of damage test methods were used to confirm the mitigation efficiency of the protocol. The results indicate that the damage resistance capability of mitigated sites can recover to the level of pristine substrate.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Yong Jiang, Yong Jiang, Chengsi Luo, Chengsi Luo, Chunming Liu, Chunming Liu, Xia Xiang, Xia Xiang, Xiaotao Zu, Xiaotao Zu, Xiaodong Yuan, Xiaodong Yuan, Shaobo He, Shaobo He, Wanguo Zheng, Wanguo Zheng, Haijun Wang, Haijun Wang, Haibing Lv, Haibing Lv, Wei Ren, Wei Ren, } "Mitigation of surface damage growth by hydrofluoric acid etching combined with carbon dioxide laser treatment," Optical Engineering 51(8), 084301 (2 August 2012). https://doi.org/10.1117/1.OE.51.8.084301 . Submission:
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