7 May 2013 Compact sensor combining digital speckle pattern interferometry and the hole-drilling technique to measure nonuniform residual stress fields
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Abstract
A portable device to essentially measure residual stress fields outside an optical bench is presented. This system combines the hole-drilling technique with digital speckle pattern interferometry. A novel feature of this device is its high degree of compaction since only one base supports simultaneously the measurement module and the hole-drilling device. A new version of the American society for testing and materials standard E837 for the measurement of residual stresses has been improved including a computation method for nonuniform residual stresses. According to this standard, a hole with a maximum depth of 1.0 mm should be introduced into the material to assess the stress distribution along the hole’s depth. The discretization of the stress distribution is performed in 20 equal steps of 0.05 mm, getting the deformations generated for stress relief in every drilling step. A description of the compact device showing the solution for a fast and easy interchanging process between modules is also presented. The proposed system was compared with a traditional method using strain gages, and a good agreement was shown between stress distributions measured with both methods. Finally, the portable device was used to evaluate the residual stress distribution in a sample with a rod welded by friction hydro pillar processing.
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE)
Matias R. Viotti, Matias R. Viotti, Armando Albertazzi, Armando Albertazzi, } "Compact sensor combining digital speckle pattern interferometry and the hole-drilling technique to measure nonuniform residual stress fields," Optical Engineering 52(10), 101905 (7 May 2013). https://doi.org/10.1117/1.OE.52.10.101905 . Submission:
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