8 September 2016 Laser three-dimensional printing microchannel heat sink for high-power diode laser array
Author Affiliations +
Optical Engineering, 55(9), 096105 (2016). doi:10.1117/1.OE.55.9.096105
To improve the heat management of high-power diode lasers, a microchannel heat sink is obtained, whose structure is optimized in method of numerical simulation. Following such a design, the microchannel heat sink is fabricated by nickel-based doping rare earth materials by laser three-dimensional (3-D) printing procedure. Since the noncorrosion property of such material has been preliminarily demonstrated by salt spray test, there is no necessity to plate the interior of the laser 3-D printing microchannel heat sink with gold. The coefficient of thermal expansion of such material is 11  ppm/K. The diode laser array (LDA) with 80-W cw output power, 2-mm cavity length, 100-μm emitter width, and 20% fill-factors is mounted on it for the thermal resistance test, and the result is 0.40  K/W. Moreover, the smile effect of the mounted LDA is merely 0.8  μm.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE)
Guannan Jia, Yuntao Qiu, Anru Yan, Shun Yao, Zhiyong Wang, "Laser three-dimensional printing microchannel heat sink for high-power diode laser array," Optical Engineering 55(9), 096105 (8 September 2016). https://doi.org/10.1117/1.OE.55.9.096105

Nonimpact printing

3D printing

Semiconductor lasers



High power lasers


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