12 July 2017 Thermally stable conformal encapsulation material for high-power ultraviolet light-emitting diodes
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Abstract
A conformal encapsulation material for use in high-power, thermally stable ultraviolet (UV) light-emitting diodes was successfully developed. For silicone, thermal degradation started at ∼ 200°C , and the transmittance was 85.5% at 365 nm. The transmittance decreased by 55% after thermal aging at 250°C for 72 h and it decreased further by 2.5%, even at room temperature, under continuous exposure to UV light at 365 nm for 72 h. By contrast, for the sol–gel material, thermal degradation started at ∼ 300°C , and the transmittance was 90% at 365 nm. The transmittance decreased negligibly after thermal aging at 250°C for 72 h and it did not decrease further even at 75°C under continuous exposure to UV light at 365 nm for 72 h.
© 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
Shun-Yuan Huang, Jau-Sheng Wang, "Thermally stable conformal encapsulation material for high-power ultraviolet light-emitting diodes," Optical Engineering 56(7), 077105 (12 July 2017). https://doi.org/10.1117/1.OE.56.7.077105 . Submission: Received: 6 May 2017; Accepted: 27 June 2017
Received: 6 May 2017; Accepted: 27 June 2017; Published: 12 July 2017
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