4 August 2017 Swing arm profilometer: high accuracy testing for large reaction-bonded silicon carbide optics with a capacitive probe
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Abstract
A feasible way to improve the manufacturing efficiency of large reaction-bonded silicon carbide optics is to increase the processing accuracy in the ground stage before polishing, which requires high accuracy metrology. A swing arm profilometer (SAP) has been used to measure large optics during the ground stage. A method has been developed for improving the measurement accuracy of SAP using a capacitive probe and implementing calibrations. The experimental result compared with the interferometer test shows the accuracy of 0.068    μ m in root-mean-square (RMS) and maps in 37 low-order Zernike terms show accuracy of 0.048    μ m RMS, which shows a powerful capability to provide a major input in high-precision grinding.
© 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
Ling Xiong, Ling Xiong, Xiao Luo, Xiao Luo, Hai-xiang Hu, Hai-xiang Hu, Zhi-yu Zhang, Zhi-yu Zhang, Feng Zhang, Feng Zhang, Li-gong Zheng, Li-gong Zheng, Xue-jun Zhang, Xue-jun Zhang, } "Swing arm profilometer: high accuracy testing for large reaction-bonded silicon carbide optics with a capacitive probe," Optical Engineering 56(8), 084101 (4 August 2017). https://doi.org/10.1117/1.OE.56.8.084101 . Submission: Received: 12 January 2017; Accepted: 7 June 2017
Received: 12 January 2017; Accepted: 7 June 2017; Published: 4 August 2017
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