4 April 2018 Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications
Author Affiliations +
Abstract
This study investigated the thermal properties of three-dimensional (3-D) printed components with the potential to be used for thermal management in light-emitting diode (LED) applications. Commercially available filament materials with and without a metal filler were characterized with changes to the print orientation. 3-D printed components with an in-plane orientation had >30  %   better effective thermal conductivity compared with components printed with a cross-plane orientation. A finite-element analysis was modeled to understand the effective thermal conductivity changes in the 3-D printed components. A simple thermal resistance model was used to estimate the required effective thermal conductivity of the 3-D printed components to be a viable alternative in LED thermal management applications.
© 2018 Society of Photo-Optical Instrumentation Engineers (SPIE)
Indika U. Perera, Nadarajah Narendran, Valeria Terentyeva, "Thermal characterization of three-dimensional printed components for light-emitting diode lighting system applications," Optical Engineering 57(4), 041411 (4 April 2018). https://doi.org/10.1117/1.OE.57.4.041411 . Submission: Received: 5 October 2017; Accepted: 13 March 2018
Received: 5 October 2017; Accepted: 13 March 2018; Published: 4 April 2018
JOURNAL ARTICLE
8 PAGES


SHARE
RELATED CONTENT

The heat dissipation performance of LED applied a MHP
Proceedings of SPIE (September 14 2005)
White LED performance
Proceedings of SPIE (October 20 2004)
Thermal investigations on high power LEDs
Proceedings of SPIE (November 01 2012)
Thermal management methods for compact high power LED arrays
Proceedings of SPIE (September 14 2007)

Back to Top