Blind pixels are an inevitable problem in short-wave infrared (SWIR) InGaAs focal plane arrays (FPAs). An experiment using a laser beam-induced current method was set up to characterize the blind pixels in InGaAs FPAs. According to the result, the blind pixels are classified into four types: single overhot pixels, single dead pixels, crossing dead pixels, and paired blind pixels. Additionally, the causes of the different types of blind pixels are analyzed. It is indicated that the blind pixels are caused by defects and impurities, disconnection of the readout circuit, unformed PN junctions, and a wrong connection between the PN junction and readout integrated circuit, respectively. Based on the characterization, a blind pixel calibration method that greatly improved the quality of images taken by InGaAs FPAs is proposed.
You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.