Translator Disclaimer
9 March 2020 Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress
Author Affiliations +
Abstract

Due to the thermal-induced stress during the bonding process, the emitters in a laser diode array (LDA) are vertically displaced, which causes the near-field bowing of a laser diode bar (i.e., the SMILE effect). Near-field bowing degrades the laser beam brightness, adversely affecting optical coupling and beam shaping, resulting in a larger divergence angle and a wider line after focusing and collimation. The mechanism of near-field bowing has been theoretically studied, in which the ratio of tensile strength between submount and heat sink has a great effect on the deformation of LDAs. Arm-wrestling between CuW submount and heat sink vividly describes that the deformation of LDAs changes as a function of the ratio of two materials’ tensile strength. We design a symmetrical structure that bonds another submount on the bottom of the heat sink to control the SMILE effect by balancing the acting force from the top of the heat sink. The deformation of the heat sink and LDAs are approximately zero when the thermal-induced stresses forced on the top and bottom of the heat sink are equal.

© 2020 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2020/$28.00 © 2020 SPIE
Hongyou Zhang, Chung-en Zah, and Xingsheng Liu "Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress," Optical Engineering 59(3), 036104 (9 March 2020). https://doi.org/10.1117/1.OE.59.3.036104
Received: 11 December 2019; Accepted: 19 February 2020; Published: 9 March 2020
JOURNAL ARTICLE
9 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Study on the near field non linearity (SMILE) of high...
Proceedings of SPIE (February 20 2018)
Packaging of hard solder 500W QCW diode laser array
Proceedings of SPIE (April 22 2016)
Hard solder 20-kW QCW stack array diode laser
Proceedings of SPIE (February 08 2012)

Back to Top