Journal of Micro/Nanolithography, MEMS, and MOEMS

Editor-in-Chief: Chris A. Mack, Lithoguru.com, USA

The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3) publishes papers on the science, development, and practice of lithographic, fabrication, packaging, and integration technologies necessary to address the needs of the electronics, MEMS, MOEMS, and photonics industries. The wide range of such devices includes biomedical microdevices, microfluidics, sensors and actuators, adaptive optics, and digital micromirrors. The scope is broad to facilitate synergy and interest between the communities served by the journal.

Calls for Papers
How to Submit to a Special Section

To submit a manuscript for consideration in a Special Section, please prepare the manuscript according to the journal guidelines and use the Online Submission SystemLeaving site. A cover letter indicating that the submission is intended for this special section should be included with the paper. Papers will be peer‐reviewed in accordance with the journal's established policies and procedures. Authors who pay the voluntary page charges will receive the benefit of open access.

Control of Integrated Circuit Patterning Variance, Part 4: Placement and Critical Dimension, Edge to Edge Overlay
Publication Date
Special section papers are published as soon as the copyedited and typeset proofs are approved by the author.
Submission Deadline
Manuscripts due 1 November 2018.
Guest Editors
Alexander Starikov

I&I Consulting
Palo Alto, California, USA
alstarikov@gmail.com

Scope

Control of device dimensions in patterning is conventionally defined as consisting of two complementary components assumed to be independent: of size (linewidth or critical dimension, CD) and of placement (registration, wafer alignment, and layer to layer centerline to centerline overlay, OL). Two kinds of dimensional metrology are practiced for these two components, in dissimilar applications environments and typically on different tools, with process control and systematic corrections applied in two separate control loops. Control of edge-to-edge overlay (combination of two layers' CDs and OL), the design rule responsible for yield, is now widely recognized as limiting conventional lithography's progress.     

Lithography extensions through pitch multiplication and directed self-assembly lead to intermixing of CD and OL. Unlike in conventional lithography, where different physical mechanisms driving size variations and placement errors justify separate metrology and control, there is a strong need to self-consistently measure and control both CD and OL together. New approaches to IC patterning and the unprecedented expectations of device OL drive demand for complementary metrology and control of both pattern size and placement.

This special section of the Journal of Micro/Nanolithography, MEMS, and MOEMS seeks to offer comprehensive technology overviews of pattern placement, in-depth accounts of the latest technology and metrology equipment, pattern size and placement variation, metrology error, applications methods for control of size and placement, ultimately, of CD and edge-to-edge overlay in device layouts.  

Please submit a technology overview, a consolidation of earlier work, or an original technical paper related to metrology and control of pattern size and placement and device overlay in IC manufacture.  Topics of interest include, but are not limited to, the following:

Alignment, registration, and overlay metrology

  • Metrology of centerlines and the associated performance-limiting issues
  • Measurement self-consistency, matching, accuracy, cross-technology comparisons
  • Tool-related error mechanisms, their control and reduction, performance metrics
  • Metrology-design-process integration, metrology quality and performance metrics
  • Ultimate performance of metrology of pattern placement, hybrid metrology

Methods, technologies, and applications for control of edge-to-edge overlay

  • Device yield/performance and e-test versus in-line measurement of CD and OL
  • Sources of device size and placement variations, their signatures in space and time
  • Segmentation of device variance and control of its principal components
  • Modeling, prediction, and control of systematic variations, and of residual components
  • Design, metrology, and process integration for efficient high-volume manufacturing


All papers will undergo the standard peer-review process for the Journal of Micro/Nanolithography, MEMS and MOEMS (JM3). Manuscripts should be submitted to SPIE according to the journal's author guidelines. A cover letter indicating that the submission is intended for this special section should be included. For more information, please contact the Guest Editor or jm3@spie.org.


IC
Published Special Sections

Challenges and Approaches to EUV-Based Patterning for High-Volume Manufacturing Applications (January-March 2019)
Guest Editors: Sebastian Engelmann, Rich Wise, Roel Gronheid, and Nelson Felix

Control of Integrated Circuit Patterning Variance, Part 3: Pattern Roughness, Local Uniformity, and Stochastic Defects (October-December 2018)
Guest Editors: John C. Robinson, Tim Brunner, Gian Lorusso

Novel Patterning Technologies (July-September 2018)
Guest Editors: Eric Panning and Martha Sanchez

EUV Lithography for the 3-nm Node and Beyond (October-December 2017)
Guest Editors: Vivek Bakshi, Hakaru Mizoguchi, Ted Liang, Andrew Grenville, and Jos Benschop

Alternative Lithographic Technologies V (July-September 2016)
Guest Editors: Chris Bencher and Ricardo Ruiz

Control of Integrated Circuit Patterning Variance, Part 2: Image Placement, Device Overlay, and Critical Dimension (April-June 2016)
Guest Editor: Alexander Starikov

Photomask Manufacturing Technology (April-June 2016)
Guest Editors: Masato Shibuya, Morihisa Hoga, and Kiwamu Takehisa

Extending VLSI and Alternative Technology with Optical and Complementary Lithography (April-June 2016)
Guest Editors: Kafai Lai and Andreas Erdmann

On the Interface of Holography and MEMS (October-December 2015)
Guest Editors: Partha Banerjee, Pierre-Alexandre Blanche, Christophe Moser, and Myung K. Kim

Alternative Lithographic Technologies IV (July-September 2015)
Guest Editors: Douglas J. Resnick, Ricardo Ruiz, and Hans Loeschner

Control of Integrated Circuit Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension (April-June 2015)
Guest Editors: Alexander Starikov and Matthew Sendelbach

Continuation of Scaling with Optical and Complementary Lithography (January-March 2015)
Guest Editors: Kafai Lai and Andreas Erdmann

Holistic/Hybrid Metrology (October-December 2014)
Guest Editors: Alok Vaid and Eric Solecky

Alternative Lithographic Technologies III (July-September 2014)
Guest Editors: Douglas J. Resnick, Christopher Bencher, and Ricardo Ruiz

Metrology and Inspection for 3-D Integrated Circuits and Interconnects (January-March 2014)
Guest Editors: Yi-sha Ku and Alexander Starikov

Emerging MOEMS Technology and Applications (January-March 2014)
Guest Editors: M. Edward Motamedi, Joel Kubby, Patrick Ian Oden, and Wibool Piyawattanametha

Optical Lithography Extension Beyond the 14-nm Node (January-March 2014)
Guest Editors: Will Conley and Kafai Lai

Advanced Fabrication of MEMS and Photonic Devices (October-December 2013)
Guest Editors: Georg von Freymann, Mary Ann Maher, and Thomas J. Suleski

Advanced Plasma-Etch Technology (October-December 2013)
Guest Editors: Ying Zhang, Qinghuang Lin, and Gottlieb S. Oehrlein

Alternative Lithographic Technologies (July-September 2013)
Guest Editors: Will Tong and Douglas J. Resnick

Photomasks for EUV Lithography (April-June 2013)
Guest Editors: Christopher J. Progler and Frank E. Abboud

Alternative Lithographic Technologies (July-September 2012)
Guest Editors: William M. Tong, Douglas J. Resnick, and Benjamin Rathsack

Directed Self-Assembly (July-September 2012)
Guest Editors: Daniel P. Sanders and William H. Arnold

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS III (April-June 2012)
Guest Editors: Sonia M. García-Blanco and Rajeshuni Ramesham

EUV Sources for Lithography (April-June 2012)
Guest Editors: Vivek Bakshi and Anthony Yen

Dimensional Metrology with Atomic Force Microscopy: Instruments and Applications (January-March 2012)
Guest Editors: Ronald Dixson and Ndubuisi G. Orji

Theory and Practice of MEMS, NEMS, and MOEMS (January-March 2011)
Guest Editor: Yu-Cheng Lin

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II (October-December 2010)
Guest Editor: Rajeshuni Ramesham

Line-Edge Roughness (October-December 2010 )
Guest Editors: Chris A. Mack and Will Conley

Metrology (October-December 2010 )
Guest Editors: Moshe Preil and Shaunee Cheng

BioMEMS, Theory and Practice of MEMS/NEMS, and Sensors (July-September 2010)
Guest Editor: Yu-Cheng Lin

Extreme-Ultraviolet Lithography (October-December 2009)
Guest Editors: Kevin Cummings and Kazuaki Suzuki

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS (July-September 2009)
Guest Editors: Rajeshuni Ramesham and Allyson L. Hartzell

Computational Lithography (July-September 2009)
Guest Editors: Donis Flagello and Chris Mack

Theory and Practice of MEMS/NEMS/MOEMS, RF MEMS, and BioMEMS (April-June 2009)
Guest Editor: Yu-Cheng Lin

Extreme-Ultraviolet Interference Lithography (April-June 2009)
Guest Editor: Franco Cerrina

Double-Patterning Lithography (January-March 2009)
Guest Editor: William H. Arnold

Silicon-Based MOEMS and Their Applications (April-June 2008)
Guest Editors: Harald Schenk and Wibool Piyawattanametha

Resolution Enhancement Techniques and Design for Manufacturability (July-September 2007)
Guest Editor: Alfred K. K. Wong

Bio-MEMS and Microfluidics (April-June 2006)
Guest Editors: Wanjun Wang and Ian Papautsky

Nanopatterning (January-March 2006)
Guest Editors: Kees Eijkel, Jill Hruby, Glen Kubiak, M. Scott, Volker Saile, and Steven Walsh

MOEMS Design, Technology, and Applications (October-December 2005)
Guest Editor: M. Edward Motamedi

Polarization and Hyper-NA Lithography (July-September 2005)
Guest Editor: Donis Flagello and Christopher J. Progler

Next Generation Lithography (January-March 2005)
Guest Editor: Walt Trybula

Mask Technology for Optical Lithography (April-June 2004)
Guest Editor: Kevin D. Cummings and Frank M. Schellenberg

Immersion Lithography (January-March 2004)
Guest Editor: William H. Arnold

Surface Micromachining (October-December 2003)
Guest Editors: Jeffry J. Sniegowski and James H. Smith

Micro-Optics for Photonic Networks (October-December 2003)
Guest Editor: Thomas J. Suleski

Lithography for Sub-100-nm Device Fabrication (October-December 2002)
Guest Editor: William H. Arnold

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