Journal of Micro/Nanolithography, MEMS, and MOEMS
VOL. 19 · NO. 1 | January 2020
SPIE publishes accepted journal articles as soon as they are approved for publication. Journal issues are considered In Progress until all articles for an issue have been published. Articles published ahead of the completed issue are fully citable.
J. Micro/Nanolith. MEMS MOEMS 19(1), 010101 (12 February 2020)
TOPICS: Lithography, Heat treatments, Semiconductors, Metrology, Microelectromechanical systems, Microopto electromechanical systems
J. Micro/Nanolith. MEMS MOEMS 19(1), 010102 (20 January 2020)
TOPICS: Lithium, Microelectromechanical systems, Microopto electromechanical systems, Fluctuations and noise, Plutonium, Alternate lighting of surfaces
J. Micro/Nanolith. MEMS MOEMS 19(1), 013501 (7 January 2020)
TOPICS: Polymers, Scanning probe lithography, Reflection, Nanolithography, Prototyping, Reflectivity, Diffraction gratings, Silicon, Optical lithography, Oxides
J. Micro/Nanolith. MEMS MOEMS 19(1), 013502 (22 February 2020)
TOPICS: Convolution, Process modeling, Photoresist materials, Optical simulations, Optical proximity correction, Source mask optimization, System on a chip, Printing, Photoresist processing, Geometrical optics
J. Micro/Nanolith. MEMS MOEMS 19(1), 014001 (28 January 2020)
TOPICS: Diffraction, Scattering, X-rays, Diffraction gratings, Monte Carlo methods, Optical lithography, Metrology, Silicon, Sensors, Manufacturing
J. Micro/Nanolith. MEMS MOEMS 19(1), 014002 (30 January 2020)
TOPICS: Extreme ultraviolet, Carbon, Reticles, Inspection, Defect detection, Coherence imaging, Photomasks, Phase measurement, Reflectivity, Microscopes
Microelectromechanical systems (MEMS)
J. Micro/Nanolith. MEMS MOEMS 19(1), 015001 (20 February 2020)
TOPICS: Electrodes, Capacitors, Microelectromechanical systems, Capacitance, Silicon, Photomasks, Energy harvesting, Device simulation, Metals, Electromechanical design
J. Micro/Nanolith. MEMS MOEMS 19(1), 015002 (21 February 2020)
TOPICS: Microelectromechanical systems, Ferroelectric materials, Silicon, Error analysis, Semiconducting wafers, Reactive ion etching, Deep reactive ion etching, Actuators, Polishing, Motion models
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