Optical critical dimension metrology for directed self-assembly assisted contact hole shrink

Dhairya Dixit; Avery Green; Erik R. Hosler; Vimal Kamineni; Moshe E. Preil; Nick Keller; Joseph Race; Jun Sung Chun; Michael O’Sullivan; Prasanna Khare; Warren Montgomery; Alain C. Diebold

doi:10.1117/1.JMM.15.1.014004

14 March 2016 Optical critical dimension metrology for directed self-assembly assisted contact hole shrink

Dhairya Dixit, Avery Green, Erik R. Hosler, Vimal Kamineni, Moshe E. Preil, Nick Keller, Joseph Race, Jun Sung Chun, Michael O’Sullivan, Prasanna Khare, Warren Montgomery, Alain C. Diebold

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 15, Issue 1, 014004 (March 2016). https://doi.org/10.1117/1.JMM.15.1.014004

Abstract

Directed self-assembly (DSA) is a potential patterning solution for future generations of integrated circuits. Its main advantages are high pattern resolution (∼10 nm), high throughput, no requirement of high-resolution mask, and compatibility with standard fab-equipment and processes. The application of Mueller matrix (MM) spectroscopic ellipsometry-based scatterometry to optically characterize DSA patterned contact hole structures fabricated with phase-separated polystyrene-b-polymethylmethacrylate (PS-b-PMMA) is described. A regression-based approach is used to calculate the guide critical dimension (CD), DSA CD, height of the PS column, thicknesses of underlying layers, and contact edge roughness of the post PMMA etch DSA contact hole sample. Scanning electron microscopy and imaging analysis is conducted as a comparative metric for scatterometry. In addition, optical model-based simulations are used to investigate MM elements’ sensitivity to various DSA-based contact hole structures, predict sensitivity to dimensional changes, and its limits to characterize DSA-induced defects, such as hole placement inaccuracy, missing vias, and profile inaccuracy of the PMMA cylinder.

Citation Download Citation

Dhairya Dixit, Avery Green, Erik R. Hosler, Vimal Kamineni, Moshe E. Preil, Nick Keller, Joseph Race, Jun Sung Chun, Michael O’Sullivan, Prasanna Khare, Warren Montgomery, and Alain C. Diebold "Optical critical dimension metrology for directed self-assembly assisted contact hole shrink," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(1), 014004 (14 March 2016). https://doi.org/10.1117/1.JMM.15.1.014004

Published: 14 March 2016

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available