16 February 2017 Errata: Fabrication of through-silicon via arrays by photo-assisted electrochemical etching and supercritical electroplating
Author Affiliations +
Abstract
This PDF file contains the errata for “JM3 Vol. 16 Issue 01 Paper JM3-2017-0203-ERR” for JM3 Vol. 16 Issue 01

This article [J. Micro/Nanolith. MEMS MOEMS 16, 014501 (2017)] was originally published with an error in the title.

The term “through-silicon” appeared as “though-silicon.” All online versions of the article were corrected on 06 February 2017. The article appears correctly in print.

© 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
Ho-Chiao Chuang, Ho-Chiao Chuang, Hsi-Min Yang, Hsi-Min Yang, Cheng-Xiang Wu, Cheng-Xiang Wu, Jorge Sanchez, Jorge Sanchez, Jenq-Huey Shyu, Jenq-Huey Shyu, } "Errata: Fabrication of through-silicon via arrays by photo-assisted electrochemical etching and supercritical electroplating," Journal of Micro/Nanolithography, MEMS, and MOEMS 16(1), 019801 (16 February 2017). https://doi.org/10.1117/1.JMM.16.1.019801 . Submission:
JOURNAL ARTICLE
1 PAGES


SHARE
RELATED CONTENT

Stress analysis of shape memory alloy composites
Proceedings of SPIE (October 20 2009)
Undergraduate optics program for the 21st Century
Proceedings of SPIE (May 27 2002)
Novel wafer-through technique for interconnects
Proceedings of SPIE (November 18 2001)
Fracture toughness study on LIGA fabricated microstructures
Proceedings of SPIE (January 15 2003)

Back to Top