10 April 2018 Ball-milled dispersed network of graphene platelets as thermal interface materials for high-efficiency heat dissipation of electronic devices
Tien-Chan Chang, Chun-An Liao, Zhi-Yu Lin, Yiin-Kuen Fuh
Author Affiliations +
Abstract
Thermal interface material (TIM) is a key component to dissipate the accumulated heat in the majority of power electronic systems. In this work, a facile and solid-state ball-milling method is adopted for the solvent-free reduction of exfoliated graphite nanoplatelets (EGNs) into high-quality ball-milled exfoliated graphite nanoplatelet (BMEGN) fillers. In addition, BMEGN fillers are embedded and uniformly dispersed with polydimethylsiloxane (PDMS) matrix to make a highly stretchable BMEGN-embedded PDMS-TIMs (BMEGN/PDMS) with strongly enhanced thermal conductivity. Furthermore, material characterizations were thoroughly investigated using scanning electron microscopy, transmission electron microscope, Raman spectroscopy, thermogravimetric analysis, and x-ray diffraction. Improvements in the thermal conductivity of TIMs by adding BMEGN were compared, the thermal conductivity was observed for BMEGN fillers with 0- to 48-h ball-milling time, and an enhanced in-plane thermal conductivity of 15.04 to 16.91 W/mK and through-plane thermal conductivity of 1.03 to 1.19 W/mK can be experimentally measured. A strong anisotropy was observed in the range of 14.60 (BMEGN12h/PDMS) to 14.21 (BMEGN48h/PDMS). The results reveal that the ball-milled graphene filler network with branched morphology can effectively provide the synergetic effect of a thermally conductive pathway via diffusion of phonon vibration in flexible composites. The combination of thermal conductivity and thermal stability may facilitate the applications in thermal management.
© 2018 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2018/$25.00 © 2018 SPIE
Tien-Chan Chang, Chun-An Liao, Zhi-Yu Lin, and Yiin-Kuen Fuh "Ball-milled dispersed network of graphene platelets as thermal interface materials for high-efficiency heat dissipation of electronic devices," Journal of Micro/Nanolithography, MEMS, and MOEMS 17(2), 024001 (10 April 2018). https://doi.org/10.1117/1.JMM.17.2.024001
Received: 30 November 2017; Accepted: 15 March 2018; Published: 10 April 2018
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Composites

Graphene

Interfaces

Thermal effects

Field effect transistors

Anisotropy

Electronic components

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