journal of micro nanolithography mems and moems
VOL. 6 · NO. 3 | July 2007
CONTENTS
Editorial
J. Micro/Nanolith. MEMS MOEMS 6(3), 030101 (1 July 2007) doi:10.1117/1.2793804
Special Section on Resolution Enhancement Techniques and Design for Manufacturability
J. Micro/Nanolith. MEMS MOEMS 6(3), 031002 (1 July 2007) doi:10.1117/1.2778447
TOPICS: Photomasks, Diffraction, Polarization, Refractive index, Lithography, Electromagnetism, Binary data, Water, Lithographic illumination, Critical dimension metrology
J. Micro/Nanolith. MEMS MOEMS 6(3), 031003 (1 July 2007) doi:10.1117/1.2783418
TOPICS: Apodization, Optical proximity correction, Pellicles, Data modeling, Lithography, Signal attenuation, Critical dimension metrology, Gaussian filters, Calibration, Optical filters
Peng Yu, Sean Shi, David Pan
J. Micro/Nanolith. MEMS MOEMS 6(3), 031004 (1 July 2007) doi:10.1117/1.2752814
TOPICS: Optical proximity correction, Lithography, Photomasks, Calibration, Critical dimension metrology, Photoresist materials, Convolution, Systems modeling, Data modeling, Image processing
J. Micro/Nanolith. MEMS MOEMS 6(3), 031005 (1 July 2007) doi:10.1117/1.2774994
TOPICS: Optical proximity correction, Tolerancing, Photomasks, Critical dimension metrology, Resolution enhancement technologies, Model-based design, Lithography, Computer programming, Capacitance, Semiconductors
Tim Fühner, Andreas Erdmann, Sebastian Seifert
J. Micro/Nanolith. MEMS MOEMS 6(3), 031006 (1 July 2007) doi:10.1117/1.2785031
TOPICS: Photomasks, Lithography, Genetic algorithms, Lithographic illumination, Binary data, Optimization (mathematics), Manufacturing, Critical dimension metrology, Image processing, Computer simulations
J. Micro/Nanolith. MEMS MOEMS 6(3), 031007 (1 July 2007) doi:10.1117/1.2774987
TOPICS: Optical proximity correction, Design for manufacturing, Data modeling, Process modeling, Image processing, Photoresist materials, Photomasks, Calibration, Lithography, Model-based design
J. Micro/Nanolith. MEMS MOEMS 6(3), 031008 (1 July 2007) doi:10.1117/1.2781584
TOPICS: Optical proximity correction, Design for manufacturability, Lithography, Design for manufacturing, Metals, Scanning electron microscopy, Semiconducting wafers, Holmium, Calibration, Integrated circuit design
J. Micro/Nanolith. MEMS MOEMS 6(3), 031009 (1 July 2007) doi:10.1117/1.2775471
TOPICS: Computer aided design, Optical proximity correction, Critical dimension metrology, Design for manufacturing, Field effect transistors, Manufacturing, Photomasks, Lithography, Analog electronics, Etching
J. Micro/Nanolith. MEMS MOEMS 6(3), 031010 (1 July 2007) doi:10.1117/1.2785030
TOPICS: Metals, Lithography, Optical proximity correction, Logic devices, Calibration, Manufacturing, Semiconducting wafers, Logic, Design for manufacturability, Image processing
Tejas Jhaveri, Vyacheslav Rovner, Larry Pileggi, Andrzej Strojwas, Dipti Motiani, Veerbhan Kheterpal, Kim Yaw Tong, Thiago Hersan, Davide Pandini
J. Micro/Nanolith. MEMS MOEMS 6(3), 031011 (1 July 2007) doi:10.1117/1.2781583
TOPICS: Logic, Metals, Manufacturing, Lithography, Standards development, Silicon, Integrated circuit design, Design for manufacturability, Optical proximity correction, Resolution enhancement technologies
Articles
J. Micro/Nanolith. MEMS MOEMS 6(3), 033001 (1 July 2007) doi:10.1117/1.2770472
TOPICS: Modulation, Critical dimension metrology, Electron beam direct write lithography, Point spread functions, Electron beam lithography, Cadmium sulfide, Electron beams, Optical lithography, Manufacturing, Backscatter
Melanie Kessels, M. El Bouz, R. Pagan, Kevin Heggarty
J. Micro/Nanolith. MEMS MOEMS 6(3), 033002 (1 July 2007) doi:10.1117/1.2767331
TOPICS: Spatial light modulators, LCDs, Photoresist materials, Binary data, Optical lithography, Photomasks, Reticles, Prototyping, Super resolution, Liquid crystals
Juan Lopez Gejo, Joy Kunjappu, Willard Conley, Paul Zimmerman, Nicholas Turro
J. Micro/Nanolith. MEMS MOEMS 6(3), 033003 (1 July 2007) doi:10.1117/1.2778641
TOPICS: Oxygen, Absorption, Argon, Microfluidics, Absorbance, Refractive index, Optical lithography, Nitrogen, Molecules, Oxidation
J. Alberto Rivas-Cordona, Debjyoti Banerjee
J. Micro/Nanolith. MEMS MOEMS 6(3), 033004 (1 July 2007) doi:10.1117/1.2778685
TOPICS: Scanning probe lithography, Microfluidics, Humidity, Silicon, Nanolithography, Semiconducting wafers, Thermoelectric materials, Directed energy weapons, Nanostructures, Fractal analysis
J. Micro/Nanolith. MEMS MOEMS 6(3), 033005 (1 July 2007) doi:10.1117/1.2777158
TOPICS: Bragg cells, Acousto-optics, Acoustics, Photomasks, Spiral phase plates, Transducers, Phase shift keying, Optical lithography, Spatial filters, Image enhancement
J. Micro/Nanolith. MEMS MOEMS 6(3), 033006 (1 July 2007) doi:10.1117/1.2778644
TOPICS: Silicon, Titanium, Gold, Metals, Copper, Chromium, Polymethylmethacrylate, Semiconducting wafers, X-ray lithography, Chemical analysis
Edward Ochoa, Lavern Starman, Robert Bedford, Thomas Nelson, James Ehret, Michael Harvey, Travis Anderson, Fan Ren
J. Micro/Nanolith. MEMS MOEMS 6(3), 033007 (1 July 2007) doi:10.1117/1.2767326
TOPICS: Gold, Actuators, Aluminum, Gallium, Reflectors, Microelectromechanical systems, Silicon, Distributed Bragg reflectors, Optical lithography, Chemistry
Nan-Chyuan Tsai, Chung-Yang Sue, Chih-Che Lin
J. Micro/Nanolith. MEMS MOEMS 6(3), 033008 (1 July 2007) doi:10.1117/1.2778645
TOPICS: Gyroscopes, Electrodes, Finite element methods, Sensors, Capacitors, Nonlinear dynamics, Photomasks, Mechanical engineering, Motion measurement, Reliability
Yi Xu, Ji Shen, Jia Lu, Zhiyu Wen
J. Micro/Nanolith. MEMS MOEMS 6(3), 033009 (1 July 2007) doi:10.1117/1.2770459
TOPICS: Silicon, Etching, Electrodes, Semiconducting wafers, Fabrication, Thermal oxidation, Diffusion, Lithography, Array processing, Boron
J. Micro/Nanolith. MEMS MOEMS 6(3), 033010 (1 July 2007) doi:10.1117/1.2775458
TOPICS: Mirrors, Reliability, Microelectromechanical systems, Optical design, Packaging, Reflectivity, Microopto electromechanical systems, Tolerancing, Lenses, Silicon
Changchun Hsu, Chingfu Tsou, Weileun Fang
J. Micro/Nanolith. MEMS MOEMS 6(3), 033011 (1 July 2007) doi:10.1117/1.2778431
TOPICS: Thin films, Nickel, Silicon, Etching, Finite element methods, Electroplating, Microelectromechanical systems, Sensors, Silicon films, Scanning electron microscopy
Back to Top