Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter

Changchun Hsu; Chingfu Tsou; Weileun Fang

doi:10.1117/1.2778431

1 July 2007 Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter

Changchun Hsu, Chingfu Tsou, Weileun Fang

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 6, Issue 3, 033011 (July 2007). https://doi.org/10.1117/1.2778431

Abstract

It is convenient to characterize thin film material properties using commercially available nanoindentation systems. This study aims to discuss several considerations while determining the thin film elastic modulus by means of a microcantilever bending test using a commercial nanoindentation system. The measurement results are significantly improved after: 1. the indentation of the film during the test is considered and corrected, and 2. the boundary effects are considered in the model by finite element method. In application, the elastic modulus of electroplating nickel film 11 μm thick was characterized.

©(2007) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Changchun Hsu, Chingfu Tsou, and Weileun Fang "Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(3), 033011 (1 July 2007). https://doi.org/10.1117/1.2778431

Published: 1 July 2007

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