Flip bonding with SU-8 for hybrid AlxGa1−xAs-polysilicon MEMs-tunable filter

Edward M. Ochoa; Lavern A. Starman; Robert G. Bedford; Thomas R. Nelson Jr.; James E. Ehret; Michael Harvey; Travis Anderson; Fan Ren

doi:10.1117/1.2767326

1 July 2007 Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter

Edward M. Ochoa, Lavern A. Starman, Robert G. Bedford, Thomas R. Nelson Jr., James E. Ehret, Michael Harvey, Travis Anderson, Fan Ren

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 6, Issue 3, 033007 (July 2007). https://doi.org/10.1117/1.2767326

Abstract

We report the influence of bonding temperature on SU-8 to SU-8 bonding and report fabrication of a hybrid microelectromechanical-tunable filter (MEM-TF) using SU-8 bond pads. We demonstrate use of 2-μm-thick 50×50-μm² SU-8 bond pads to attach 4.92-μm-thick 250×250-μm² Al_0.4Ga_0.6As-GaAs distributed Bragg reflectors (DBR) to polysilicon MUMPs^® piston actuators. Advantages of this process include compatibility with hydrofluoric-acid-release chemistry, low-temperature/low-pressure bonding, simple bond-pad photolithography, 57% flip-bonded DBR yield, and 30% electrostatically actuatable hybrid MEM-TF yield.

©(2007) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Edward M. Ochoa, Lavern A. Starman, Robert G. Bedford, Thomas R. Nelson Jr., James E. Ehret, Michael Harvey, Travis Anderson, and Fan Ren "Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(3), 033007 (1 July 2007). https://doi.org/10.1117/1.2767326

Published: 1 July 2007

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