The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3) publishes papers on the science, development, and practice of lithographic, fabrication, packaging, and integration technologies necessary to address the needs of the electronics, MEMS, MOEMS, and photonics industries. The wide range of such devices includes biomedical microdevices, microfluidics, sensors and actuators, adaptive optics, and digital micromirrors. The scope is broad to facilitate synergy and interest between the communities served by the journal.
Editor-in-Chief: Chris A. Mack, Lithoguru.com, USA
Tilted beam scanning electron microscopy, 3-D metrology for microelectronics industry
Charles Valade et al.
Special Section on Control of Integrated Circuit Patterning Variance, Part 4: Placement and Critical Dimension, Edge to Edge Overlay
Guest Editor: Alexander Starikov
Influence of secondary effects in the fabrication of submicron resist structures using deep x-ray lithography
Abrar Faisal et al.
Top Downloads of All Time
from the Journal of Micro/Nanolithography, MEMS, and MOEMS
Tin laser-produced plasma as the light source for extreme ultraviolet lithography high-volume manufacturing: history, ideal plasma, present status, and prospects
Toshihisa Tomie (2012)
Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress
Timothy A. Brunner et al. (2013)
Fabrication of ultrahigh aspect ratio silicon nanostructures using self-assembled gold metal-assisted chemical etching
Joshua M. Duran, Andrew Sarangan (2017)
Wavefront control in space with MEMS deformable mirrors for exoplanet direct imaging
Kerri L. Cahoy et al. (2013)
Multi-aperture optics for wafer-level cameras
Andreas Brückner, Robert Leitel, Alexander Oberdörster, Peter Dannberg, Frank C. Wippermann, Andreas Bräuer (2011)
Electron multibeam technology for mask and wafer writing at 0.1 nm address grid
Elmar Platzgummer, Christof Klein, Hans Loeschner (2013)
Orientation Zernike polynomials: a useful way to describe the polarization effects of optical imaging systems
Johannes Ruoff, Michael Totzeck (2009)
Role of wafer geometry in wafer chucking
Kevin T. Turner, Roshita Ramkhalawon, Jaydeep K. Sinha (2013)
Site-specific metrology, inspection, and failure analysis of three-dimensional interconnects using focused ion beam technology
Frank Altmann, Richard J. Young (2014)
Fabrication of a needle-type pH sensor by selective electrodeposition
Woo-Hyuck Choi, Ian Papautsky (2011)
Video introduction to the journal
Author benefits:
- Rigorous and prompt peer review
- Rapid, e-first publication of articles
- Professional copyediting and typesetting
- Free online color figures
- Free inclusion of videos and multimedia
- Open access publication option at a low cost
- 5 free downloads from the SPIE Digital Library for authors
- Integration with Code Ocean, a cloud-based code development and publishing platform
Receive Email Alerts
