Fabrication of micro-bump array using a photosensitive conductive polymer for the integration of micro-light-emitting diode displays

Xueqi Zhu; Taifu Lang; Xin Lin; Xiaowei Huang; Yujie Xie; Yang Li; Yijian Zhou; Yifan Yang; Chang Lin; Jie Sun; Xiongfu Zhou; Tailiang Guo; Qun Yan

doi:10.1117/1.JMM.23.4.044901

29 October 2024 Fabrication of micro-bump array using a photosensitive conductive polymer for the integration of micro-light-emitting diode displays

Xueqi Zhu, Taifu Lang, Xin Lin, Xiaowei Huang, Yujie Xie, Yang Li, Yijian Zhou, Yifan Yang, Chang Lin, Jie Sun, Xiongfu Zhou, Tailiang Guo, Qun Yan

Author Affiliations +

Journal of Micro/Nanopatterning, Materials, and Metrology, Vol. 23, Issue 4, 044901 (October 2024). https://doi.org/10.1117/1.JMM.23.4.044901

Abstract

Background

Recently, micro-light-emitting diode (micro-LED) displays have gained significant interest from both industry and academia due to their exceptional performance. However, the integration of micro-LED with the driver substrate during the fabrication process remains a pressing issue that needs to be addressed.

Aim

We plan to realize high-yield bonding of micro-LED displays by adopting new materials.

Approach

We opted for a photoresist with conductive properties by incorporating carbon black as the bonding material to fabricate a micron-level bump array.

Results

This method, using only photolithography, achieves a yield of 99.99% or higher in a single step. It eliminates the need for time-consuming processes such as lift-off and vaporization in the traditional metal bump preparation process. The resulting array can be directly used to establish electrical connections with the micro-LED array. After fabrication of the bump array on the thin film transistor (TFT) driver substrate, the 80×80 micro-LED array was integrated into the TFT substrate, and after baking, a device yield of over 99.9% was attained.

Conclusions

This work presents a streamlined and more effective method for integrating the micro-LED and TFT driver substrate, resulting in significant reductions in both time and economic expenses associated with the production process of micro-LED displays.

Citation Download Citation

Xueqi Zhu, Taifu Lang, Xin Lin, Xiaowei Huang, Yujie Xie, Yang Li, Yijian Zhou, Yifan Yang, Chang Lin, Jie Sun, Xiongfu Zhou, Tailiang Guo, and Qun Yan "Fabrication of micro-bump array using a photosensitive conductive polymer for the integration of micro-light-emitting diode displays," Journal of Micro/Nanopatterning, Materials, and Metrology 23(4), 044901 (29 October 2024). https://doi.org/10.1117/1.JMM.23.4.044901

Received: 8 August 2024; Accepted: 2 October 2024; Published: 29 October 2024

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