Through-process modeling for design-for-manufacturability applications

Scott M. Mansfield; Geng Han; Lars W. Liebmann

doi:10.1117/1.2774987

1 July 2007 Through-process modeling for design-for-manufacturability applications

Scott M. Mansfield, Geng Han, Lars W. Liebmann

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 6, Issue 3, 031007 (July 2007). https://doi.org/10.1117/1.2774987

Abstract

In recent years, design for manufacturability (DFM) has become an important focus item of the semiconductor industry and many new DFM applications have arisen. Most of these applications rely heavily on the ability to model process sensitivity, and here we explore the role of through-process modeling on DFM applications. Several different DFM applications are examined and their lithography model requirements analyzed. The complexities of creating through-process models are then explored, and methods to ensure their accuracy presented.

©(2007) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

Scott M. Mansfield, Geng Han, and Lars W. Liebmann "Through-process modeling for design-for-manufacturability applications," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(3), 031007 (1 July 2007). https://doi.org/10.1117/1.2774987

Published: 1 July 2007

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