The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Formerly the Journal of Micro/Nanolithography, MEMS, and MOEMS, the journal’s key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.
Editor-in-Chief:
Harry Levinson, HJL Lithography, USA
Perspectives and tradeoffs of absorber materials for high NA EUV lithography
Andreas Erdmann et al.
Rayleigh or Abbe? Origin and naming of the resolution formula of microlithography
Anthony Yen
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from the Journal of Micro/Nanopatterning, Materials, and Metrology
Perspectives and tradeoffs of absorber materials for high NA EUV lithography
Andreas Erdmann, Hazem S. Mesilhy, Peter Evanschitzky, Vicky Philipsen, Frank J. Timmermans, Markus Bauer (2020)
Particle and pattern discriminant freeze-cleaning method
Kei Hattori, Daisuke Matsushima, Kensuke Demura, Masaya Kamiya (2020)
Direct comparison of line edge roughness measurements by SEM and a metrological tilting-atomic force microscopy for reference metrology
Ryosuke Kizu, Ichiko Misumi, Akiko Hirai, Satoshi Gonda (2020)
Review of scanning electron microscope-based overlay measurement beyond 3-nm node device
Osamu Inoue, Kazuhisa Hasumi (2019)
Design, simulation, and fabrication of three-dimensional microsystem components using grayscale photolithography
Melissa A. Smith, et al. (2019)
Retrospective on VLSI value scaling and lithography
Michael L. Rieger (2019)
Review of microshutters for switchable glass
Boris Lamontagne, Norman R. Fong, In-Hyouk Song, Penghui Ma, Pedro J. Barrios, Daniel Poitras (2019)
Attenuated phase shift mask for extreme ultraviolet: can they mitigate three-dimensional mask effects?
Andreas Erdmann, Peter Evanschitzky, Hazem Mesilhy, Vicky Philipsen, Eric Hendrickx, Markus Bauer (2018)
High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features
Wei Sun, Hiroya Ohta, Taku Ninomiya, Yasunori Goto (2020)
Reducing roughness in extreme ultraviolet lithography
Chris A. Mack (2018)
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