Journal of Micro/Nanopatterning, Materials, and Metrology

Editor-in-Chief: 
Harry Levinson, HJL Lithography, USA

The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Formerly the Journal of Micro/Nanolithography, MEMS, and MOEMS, the journal’s key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.

Featured Content

Perspectives and tradeoffs of absorber materials for high NA EUV lithography

Andreas Erdmann et al.

Rayleigh or Abbe? Origin and naming of the resolution formula of microlithography

Anthony Yen

Particle and pattern discriminant freeze-cleaning method

Kei Hattori et al.

Most Viewed

from the Journal of Micro/Nanopatterning, Materials, and Metrology


Perspectives and tradeoffs of absorber materials for high NA EUV lithography

Andreas Erdmann, Hazem S. Mesilhy, Peter Evanschitzky, Vicky Philipsen, Frank J. Timmermans, Markus Bauer (2020) Open Access


Particle and pattern discriminant freeze-cleaning method

Kei Hattori, Daisuke Matsushima, Kensuke Demura, Masaya Kamiya (2020) Open Access


Direct comparison of line edge roughness measurements by SEM and a metrological tilting-atomic force microscopy for reference metrology

Ryosuke Kizu, Ichiko Misumi, Akiko Hirai, Satoshi Gonda (2020) Open Access


Review of scanning electron microscope-based overlay measurement beyond 3-nm node device

Osamu Inoue, Kazuhisa Hasumi (2019) Open Access


Design, simulation, and fabrication of three-dimensional microsystem components using grayscale photolithography

Melissa A. Smith, et al. (2019) Open Access


Retrospective on VLSI value scaling and lithography

Michael L. Rieger (2019) Open Access


Review of microshutters for switchable glass

Boris Lamontagne, Norman R. Fong, In-Hyouk Song, Penghui Ma, Pedro J. Barrios, Daniel Poitras (2019) Open Access


Attenuated phase shift mask for extreme ultraviolet: can they mitigate three-dimensional mask effects?

Andreas Erdmann, Peter Evanschitzky, Hazem Mesilhy, Vicky Philipsen, Eric Hendrickx, Markus Bauer (2018) Open Access


High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features

Wei Sun, Hiroya Ohta, Taku Ninomiya, Yasunori Goto (2020) Open Access


Reducing roughness in extreme ultraviolet lithography

Chris A. Mack (2018) Open Access


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