Journal of Micro/Nanopatterning, Materials, and Metrology

Editor-in-Chief: Harry Levinson, HJL Lithography, USA

The Journal of Micro/Nanopatterning, Materials, and Metrology (JM³) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Formerly the Journal of Micro/Nanolithography, MEMS, and MOEMS, the journal’s key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.

On the cover: The figure is from "Investigation on the mechanical interface stability of curved high aspect ratio x-ray gratings made by deep x-ray lithography," an open access paper by Michael Richter et al. in Vol. 21, Issue 2.

Current Issue All Issues Issues in Progress

Attenuated phase shift masks: a wild card resolution enhancement for extreme ultraviolet lithography?

Andreas Erdmann, Hazem Mesilhy, Peter Evanschitzky

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Special Section on Non-chemically Amplified Resists for EUV Lithography

Guest Editors: Anuja De Silva and Yasin Ekinci

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Special Section on Next Generation Light Source, Materials, and Metrology/Inspection Equipment

Guest Editors: Erik Hosler and Brennan Peterson

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Previously Published Special Sections

from the Journal of Micro/Nanopatterning, Materials, and Metrology

Next Generation Light Source, Materials, and Metrology/Inspection Equipment (April-June 2022)

Guest Editors: Erik R. Hosler and Brennan Peterson

Novel Patterning Technologies II (January-March 2022)

Guest Editors: Doug Resnick and Eric Panning

EUV Masks (three-part series, October-December 2020, April-June 2021, July-September 2021)

Guest Editors: Martin Burkhardt and Vicky Philipsen

Control of Integrated Circuit Patterning Variance, Part 4: Placement and Critical Dimension, Edge to Edge Overlay (April-June 2019)

Guest Editor: Alexander Starikov

Challenges and Approaches to EUV-Based Patterning for High-Volume Manufacturing Applications (January-March 2019)

Guest Editors: Sebastian Engelmann, Rich Wise, Roel Gronheid, and Nelson Felix

Control of Integrated Circuit Patterning Variance, Part 3: Pattern Roughness, Local Uniformity, and Stochastic Defects (October-December 2018)

Guest Editors: John C. Robinson, Tim Brunner, Gian Lorusso

Novel Patterning Technologies (July-September 2018)

Guest Editors: Eric Panning and Martha Sanchez

EUV Lithography for the 3-nm Node and Beyond (October-December 2017)

Guest Editors: Vivek Bakshi, Hakaru Mizoguchi, Ted Liang, Andrew Grenville, and Jos Benschop

Alternative Lithographic Technologies V (July-September 2016)

Guest Editors: Chris Bencher and Ricardo Ruiz

Control of Integrated Circuit Patterning Variance, Part 2: Image Placement, Device Overlay, and Critical Dimension (April-June 2016)

Guest Editor: Alexander Starikov

Journal Metrics:
ISSN: 1932-5150
E-ISSN: 2708-8340
CiteScore^TM 2019: 3.0
Impact Factor^*: 1.22
5-Year Impact Factor^*: 0.968
h5-index: 20
^{*Source: Journal Impact Factor^TM, from Clarivate, 2021}

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