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18 March 2024 Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers (Erratum)
Author Affiliations +
Abstract

Erratum corrects errors in Table 2.

This article [J. Opt. Microsystems 4(1), 011004 (2023) doi 10.1117/1.JOM.4.1.011004] was originally published on 6 December 2023, with erroneous values in Table 2, as shown below. The UCUT values of Simulation (pm/mW) and Difference (%) were incorrect.

Table 2

Ring modulator heater efficiency from experiments (pm/mW) and simulations (equivalent model) (K/mW). The value between brackets is obtained by the geometric model.

No UCUTUCUT
No EICWith EICNo EICWith EIC
Experiment (pm/mW)165131312180
Simulation (K/mW)3.072.145.442.86 (3.08)
Simulation (pm/mW)192134182340
Difference (%)16.32.101.0413.3

The table was corrected on 11 March 2024. The corrected table is shown below.

Table 2

Ring modulator heater efficiency from experiments (pm/mW) and simulations (equivalent model) (K/mW). The value between brackets is obtained by the geometric model.

No UCUTUCUT
No EICWith EICNo EICWith EIC
Experiment (pm/mW)165131312180
Simulation (K/mW)3.072.145.442.86 (3.08)
Simulation (pm/mW)192134340179
Difference (%)16.32.108.970.55
© 2024 Society of Photo-Optical Instrumentation Engineers (SPIE)
David Coenen, Minkyu Kim, Herman Oprins, Yoojin Ban, Dimitrios Velenis, Joris Van Campenhout, and Ingrid De Wolf "Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers (Erratum)," Journal of Optical Microsystems 4(1), 019801 (18 March 2024). https://doi.org/10.1117/1.JOM.4.1.019801
Published: 18 March 2024
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KEYWORDS
3D modeling

Silicon

Silicon photonics

Thermal modeling

Transceivers

Modulators

Engineering

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