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1 May 2008 Three-dimensional measurement of microchips using structured light techniques
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The industry dealing with microchip inspection requires fast, flexible, repeatable, and stable 3-D measuring systems. The typical devices used for this purpose are coordinate measurement machines (CMMs). These systems have limitations such as high cost, low measurement speed, and small quantity of measured 3-D points. Now optical techniques are beginning to replace the typical touch probes because of their noncontact nature, their full-field measurement capability, their high measurement density, as well as their low cost and high measurement speed. However, typical properties of microchip devices, which include a strongly spatially varying reflectance, make impossible the direct use of the classical optical 3-D measurement techniques. We present a 3-D measurement technique capable of optically measuring these devices using a camera-projector system. The proposed method improves the dynamic range of the imaging system through the use of a set of gray-code (GC) and phase-shift (PS) measures with different CCD integration times. A set of extended-range GC and PS images are obtained and used to acquire a dense 3-D measure of the object. We measure the 3-D shape of an integrated circuit and obtained satisfactory results.
©(2008) Society of Photo-Optical Instrumentation Engineers (SPIE)
Javier Vargas, Thomas P. Koninckx, Juan Antonio Quiroga, and Luc J. Van Gool "Three-dimensional measurement of microchips using structured light techniques," Optical Engineering 47(5), 053602 (1 May 2008).
Published: 1 May 2008

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