The effect of embedding MEMS strain gages in composite materials is investigated. In a preliminary phase, silicon MEMS devices are modeled as prismatic objects embedded in the composite continuum. Variations in the dimensions and mechanical properties of the composite structure and the device are considered to identify factors that affect most the structural integrity of the composite structure. A maximum size of the microsensor is determined that will allow the composite structure to tolerate 2% strain without exceeding its failure strength. A critical ratio of the microsensor device to composite structure dimension is determined.