Dr. Abhijat Goyal
at Pennsylvania State Univ
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | February 12, 2007
Proc. SPIE. 6464, MEMS/MOEMS Components and Their Applications IV
KEYWORDS: Proteins, Resonators, Quartz, Electrodes, Molecules, Crystals, Bioalcohols, Adsorption, Self-assembled monolayers, Molecular self-assembly

PROCEEDINGS ARTICLE | January 23, 2006
Proc. SPIE. 6109, Micromachining and Microfabrication Process Technology XI
KEYWORDS: Ferroelectric materials, Microsystems, Etching, Argon, Sputter deposition, Nickel, Ions, Plasma etching, Reactive ion etching, Plasma

PROCEEDINGS ARTICLE | January 6, 2006
Proc. SPIE. 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
KEYWORDS: Molecular bridges, Resonators, Silicon, Raman spectroscopy, Bridges, Boron, Chemical elements, Semiconducting wafers, Single walled carbon nanotubes, Carbon nanotubes

PROCEEDINGS ARTICLE | January 6, 2006
Proc. SPIE. 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
KEYWORDS: Diffractive optical elements, Etching, Argon, Gases, Chemistry, Surface roughness, Oxygen, Reactive ion etching, Anisotropic etching, Plasma

PROCEEDINGS ARTICLE | December 23, 2003
Proc. SPIE. 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III
KEYWORDS: Microelectromechanical systems, Packaging, Oxides, Ferroelectric materials, Glasses, Interfaces, Indium, Acoustics, Electroplating, Tin

PROCEEDINGS ARTICLE | January 16, 2003
Proc. SPIE. 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II
KEYWORDS: Microelectromechanical systems, Packaging, Polishing, Metals, Interfaces, Acoustics, Semiconducting wafers, Electroplating, Wafer bonding, Tin

Showing 5 of 6 publications
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