Dr. Adrien R. LaVoie
Sr. Manager: ALD Process Technology Development at Lam Research Corp
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 17 November 2005 Paper
Adrien Lavoie, Val Dubin
Proceedings Volume 6002, 60020J (2005) https://doi.org/10.1117/12.634884
KEYWORDS: Copper, Atomic layer deposition, Ruthenium, Metals, Diffusion, Tantalum, Chemical vapor deposition, Plating, Back end of line, Semiconductors

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