In the current paper we are addressing three questions relevant for accuracy: 1. Which target design has the best performance and depicts the behavior of the actual device? 2. Which metrology signal characteristics could help to distinguish between the target asymmetry related overlay shift and the real process related shift? 3. How does uncompensated asymmetry of the reference layer target, generated during after-litho processes, affect the propagation of overlay error through different layers? We are presenting the correlation between simulation data based on the optical properties of the measured stack and KLA-Tencor’s Archer overlay measurements on a 28nm product through several critical layers for those accuracy aspects.
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