Dr. Ahmed Gharbi
at CEA-LETI
SPIE Involvement:
Author
Publications (28)

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Metrology, Optical lithography, Etching, Polymers, Image processing, Materials processing, Manufacturing, Scanning electron microscopy, 3D metrology, Directed self assembly

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Lithography, Polymethylmethacrylate, Etching, Dry etching, Annealing, Silicon, Scanning electron microscopy, Directed self assembly, Plasma etching, Picosecond phenomena

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Semiconductors, Oxides, Optical lithography, Silicon, Materials processing, Photomasks, Directed self assembly, Critical dimension metrology, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Optical lithography, 3D acquisition, Scattering, Etching, X-rays, 3D modeling, Directed self assembly, Integrated circuits

PROCEEDINGS ARTICLE | April 10, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Lithography, Electron beam lithography, Etching, Line width roughness, Directed self assembly, Nanoimprint lithography, Critical dimension metrology, Photoresist processing, Semiconducting wafers, System on a chip

PROCEEDINGS ARTICLE | March 27, 2017
Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV
KEYWORDS: Optical lithography, Polymers, Glasses, Ultraviolet radiation, Annealing, Silicon, Scanning electron microscopy, Line width roughness, Directed self assembly, Semiconducting wafers

Showing 5 of 28 publications
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