Dr. Ajit Paranjpe
Chief Technology Officer at
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | August 19, 2005
Proc. SPIE. 5878, Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies II
KEYWORDS: Amorphous silicon, Oxides, Reticles, Metrology, Data modeling, Calibration, Scatterometry, Finite element methods, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | May 10, 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Metrology, Data modeling, Dispersion, Spectroscopy, Germanium, Silicon, Optical metrology, Reflectometry, Spectrophotometry, Semiconducting wafers

PROCEEDINGS ARTICLE | April 16, 1993
Proc. SPIE. 1803, Advanced Techniques for Integrated Circuit Processing II
KEYWORDS: Optical lithography, Etching, Dry etching, Ions, Control systems, Antennas, Photoresist processing, Semiconducting wafers, Plasma, Anisotropy

PROCEEDINGS ARTICLE | April 16, 1993
Proc. SPIE. 1803, Advanced Techniques for Integrated Circuit Processing II
KEYWORDS: Diffraction, Sensors, Etching, In situ metrology, 3D modeling, Scanning electron microscopy, Process control, Critical dimension metrology, Semiconducting wafers, Diffraction gratings

PROCEEDINGS ARTICLE | February 1, 1992
Proc. SPIE. 1593, Dry Etch Technology
KEYWORDS: Interferometers, Etching, Dry etching, Silicon, Diffusion, Interferometry, Photoresist materials, Head-mounted displays, Photoresist processing, Semiconducting wafers

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