In this study，the chip bonding processes for various chips from various chip suppliers around the world have been
optimized to achieve reliable chip on sub-mount for high performance. These chip on sub-mounts, for examples, includes
three types of bonding, 8xx nm-1.2W/10.0W Indium bonded lasers, 9xx nm 10W-20W AuSn bonded lasers and 1470 nm
6W Indium bonded lasers will be reported below. The MTTF@25℃ of 9xx nm chip on sub-mount (COS) is calculated
to be more than 203,896 hours. These chips from various chip suppliers are packaged into many multiple single emitter
laser modules, using similar packaging techniques from 2 emitters per module to up to 7 emitters per module. A
reliability study including aging test is performed on those multiple single emitter laser modules. With research team’s 12
years’ experienced packaging design and techniques, precise optical and fiber alignment processes and superior chip
bonding capability, we have achieved a total MTTF exceeding 177,710 hours of life time with 60% confidence level for
those multiple single emitter laser modules. Furthermore, a separated reliability study on wavelength stabilized laser
modules have shown this wavelength stabilized module packaging process is reliable as well.
We developed a high brightness fiber coupled diode laser module providing more than 140W output power from a
105μm NA 0.15 fiber at the wavelength of 915nm.The high brightness module has an electrical to optical efficiency
better than 45% and power enclosure more than 90% within NA 0.13. It is based on multi-single emitters using optical
and polarization beam combining and fiber coupling technique. With the similar technology, over 100W of optical power
into a 105μm NA 0.15 fiber at 976nm is also achieved which can be compatible with the volume Bragg gratings to
receive narrow and stabilized spectral linewidth. The light within NA 0.12 is approximately 92%.
The reliability test data of single and multiple single emitter laser module under high optical load are also presented and
analyzed using a reliability model with an emitting aperture optimized for coupling into 105μm core fiber. The total
MTTF shows exceeding 100,000 hours within 60% confidence level. The packaging processes and optical design are
ready for commercial volume production.