Mr. Alexey V. Shaporin
at Technische Univ Chemnitz
SPIE Involvement:
Author
Publications (4)

PROCEEDINGS ARTICLE | February 9, 2009
Proc. SPIE. 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
KEYWORDS: Microelectromechanical systems, Genetic algorithms, Microsystems, Data modeling, Doppler effect, Silicon, Manufacturing, Finite element methods, Deep reactive ion etching, Semiconducting wafers

PROCEEDINGS ARTICLE | February 18, 2008
Proc. SPIE. 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
KEYWORDS: Microelectromechanical systems, Cell phones, Doppler effect, Interferometers, Silicon, Reliability, Finite element methods, Aluminum, Velocity measurements, Semiconducting wafers

PROCEEDINGS ARTICLE | January 22, 2005
Proc. SPIE. 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
KEYWORDS: Microelectromechanical systems, Mirrors, Doppler effect, Interferometers, Manufacturing, Numerical simulations, Finite element methods, Micromirrors, Signal analyzers, Semiconducting wafers

PROCEEDINGS ARTICLE | January 22, 2005
Proc. SPIE. 5717, MEMS/MOEMS Components and Their Applications II
KEYWORDS: Signal to noise ratio, Optical filters, Mirrors, Sensors, Electrodes, Spectroscopy, Computer programming, Micromirrors, Semiconducting wafers, Signal detection

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