Ms. Allyson Hartzell Profile

Allyson Hartzell

Director of Technology Projects at Qualcomm Inc.

SPIE Involvement:

Author

Publications (6)

Proceedings Article | 28 July 2010 Paper

MEMS deformable mirrors for astronomical adaptive optics

J. Stewart, S. Cornelissen, T. Bifano, P. Bierden, A. Hartzell

Proceedings Volume 7736, 77362D (2010) https://doi.org/10.1117/12.857296

KEYWORDS: Actuators, Microelectromechanical systems, Deformable mirrors, Wavefronts, Electronics, Adaptive optics, Mirrors, Astronomical adaptive optics, Astronomy, Gemini Planet Imager

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Proceedings Article | 18 February 2010 Paper

Reliability of MEMS deformable mirror technology used in adaptive optics imaging systems

Paul Bierden, Allyson Hartzell, Daniel Davis, Steven Cornelissen, Charlie Lam

Proceedings Volume 7595, 75950B (2010) https://doi.org/10.1117/12.845610

KEYWORDS: Reliability, Actuators, Microelectromechanical systems, Mirrors, Deformable mirrors, Adaptive optics, Yield improvement, Imaging systems, Code division multiplexing, Manufacturing

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SPIE Journal Paper | 1 July 2009 Open Access

Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS

Rajeshuni Ramesham, Allyson Hartzell

JM3, Vol. 8, Issue 03, 031301, (July 2009) https://doi.org/10.1117/12.10.1117/1.3236753

KEYWORDS: Reliability, Packaging, Microelectromechanical systems, Microopto electromechanical systems, Nanofabrication

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SPIE Journal Paper | 1 July 2007

Optical microelectromechanical systems: designing for reliability

Shanti Bhattacharya, Allyson Hartzell

JM3, Vol. 6, Issue 03, 033010, (July 2007) https://doi.org/10.1117/12.10.1117/1.2775458

KEYWORDS: Mirrors, Reliability, Microelectromechanical systems, Optical design, Packaging, Reflectivity, Microopto electromechanical systems, Tolerancing, Lenses, Silicon

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Proceedings Article | 2 October 2001 Paper

MEMS reliability, characterization, and test

Allyson Hartzell, David Woodilla

Proceedings Volume 4558, (2001) https://doi.org/10.1117/12.442987

KEYWORDS: Microelectromechanical systems, Manufacturing, Reliability, Product engineering, High volume manufacturing, Quality systems, Failure analysis, Design for manufacturability, Yield improvement, Databases

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Proceedings Article | 18 August 1999 Paper

Analysis of manufacturing-scale MEMS reliability testing

David Woodilla, Allyson Hartzell, Paul Bova, Katya Delak

Proceedings Volume 3880, (1999) https://doi.org/10.1117/12.359367

KEYWORDS: Reliability, Particles, Microelectromechanical systems, Failure analysis, Manufacturing, Standards development, Electrical breakdown, Analog electronics, Microelectronics, Packaging

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Showing 5 of 6 publications

Proceedings Volume Editor (3)

SPIE Conference Volume | 6 February 2009

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII

SPIE Conference Volume | 19 February 2008

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII

SPIE Conference Volume | 20 January 2007

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI

Conference Committee Involvement (12)

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII

3 February 2014 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII

4 February 2013 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI

23 January 2012 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X

24 January 2011 | San Francisco, California, United States

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX

25 January 2010 | San Francisco, California, United States

Showing 5 of 12 Conference Committees

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