Mr. Andre Timmermann Profile

Andre Timmermann

Senior System Engineer at LIMO GmbH

SPIE Involvement:

Author

Area of Expertise:

Laser , Optics , Laser systems , Product Manager , Development

Websites:

Company Website

Publications (4)

Proceedings Article | 24 February 2009 Paper

Automated assembly of fast-axis collimation (FAC) lenses for diode laser bar modules

Jörn Miesner, Andre Timmermann, Jens Meinschien, Bernhard Neumann, Steve Wright, Tolga Tekin, Henning Schröder, Thomas Westphalen, Felix Frischkorn

Proceedings Volume 7198, 71980G (2009) https://doi.org/10.1117/12.809190

KEYWORDS: Cameras, Semiconductor lasers, Image processing, Micro optics, Imaging systems, Laser systems engineering, Collimation, Near field, Optical components, Ultraviolet radiation

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Proceedings Article | 24 February 2009 Paper

Intensity increasing up to 4 MW/cm2 with BALB's via wavelengths coupling

Andre Timmermann, Daniel Bartoschewski, Stephan Schlüter, Colin Burke, Jens Meinschien

Proceedings Volume 7198, 71980X (2009) https://doi.org/10.1117/12.807430

KEYWORDS: Semiconductor lasers, Diodes, Laser cutting, Laser marking, Laser applications, Micro optics, Beam shaping, Metals, Polarization, Laser welding

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Proceedings Article | 25 February 2008 Paper

Next generation high-brightness diode lasers offer new industrial applications

Andre Timmermann, Jens Meinschien, Peter Bruns, Colin Burke, Daniel Bartoschewski

Proceedings Volume 6876, 68760U (2008) https://doi.org/10.1117/12.763918

KEYWORDS: Semiconductor lasers, Laser cutting, Diodes, Laser marking, Laser welding, Collimation, Micro optics, Laser applications, Beam shaping, Laser systems engineering

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So far, diode laser systems could not compete against CO₂-lasers or DPSSL in industrial applications like marking or cutting due to their lower brightness. Recent developments in high-brightness diode laser bars and beam forming systems with micro-optics have led to new direct diode laser applications. LIMO presents 400W output from a 200μm core fibre with an NA of 0.22 at one wavelength. This is achieved via the combination of newly designed laser diode bars on passive heat sinks coupled with optimized micro-optical beam shaping. The laser is water cooled with a housing size of 375mm x 265mm x 70mm. The applications for such diode laser modules are mainly in direct marking, cutting and welding of metals and other materials, but improved pumping of fibre lasers and amplifiers is also possible. The small spot size leads to extremely high intensities and therefore high welding speeds in cw operation. For comparison: The M² of the fibre output is 70, which gives a comparable beam parameter product (22mm*mrad) to that of a CO₂ laser with a M² of 7 because of the wavelength difference. Many metals have a good absorption within the wavelength range of the laser diodes (NIR, 808nm to 980nm), which permits the cutting of thin sheets of aluminium or steel with a 200W version of this laser. First welding tests show reduced splatters and pores owing to the optimized process behaviour in cw operation with short wavelengths. The availability of a top-hat profile proves itself to be advantageous compared to the traditional Gaussian beam profiles of fibre, solid-state and gas lasers in that the laser energy is evenly distributed over the working area. For the future, we can announce an increase of the output power up to 1200W out of a 200μm fibre (0.22 NA). This will be achieved by further sophistication and optimisation of the coupling technique and the coupling of three wavelengths. The beam parameter product will then remain at 22mm*mrad with a power density of 3.8 MW/cm² if focussed to a 200µm spot. This leads to excellent laser cutting results with extremely small cutting kerfs down to 200μm and very plane cutting edges. Process speeds rise up to more than 10m/min i.e. for thin sheets of stainless steel or titanium.

Proceedings Article | 7 February 2007 Paper

Efficient high-brightness diode laser modules offer new industrial applications

Markus Revermann, Andre Timmermann, Jens Meinschien, Peter Bruns

Proceedings Volume 6456, 64560Q (2007) https://doi.org/10.1117/12.700438

KEYWORDS: Semiconductor lasers, Fiber coupled lasers, Laser cutting, Fiber couplers, Laser marking, Collimation, Fiber lasers, Laser applications, Diodes, Micro optics

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