Mr. Andreas Greiner Profile

Andreas Greiner

Lead Principal Engineer at Infineon Technologies Dresden GmbH & Co. KG

SPIE Involvement:

Conference Program Committee | Author

Proceedings Article | 26 June 2017 Paper

Characterization of edge effects in precision low-coherence interferometry using broadband light sources

Ch. Taudt, T. Baselt, B. Nelsen, H. Assmann, A. Greiner, E. Koch, P. Hartmann

Proceedings Volume 10329, 1032932 (2017) https://doi.org/10.1117/12.2270318

KEYWORDS: Spectroscopy, Diffraction, Radium, Plasma, Optical testing, Metrology, Light sources, Interferometry, Signal detection, Interferometers

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Proceedings Article | 20 February 2017 Presentation + Paper

Evaluation of the thermal stability of a low-coherence interferometer for precision surface profilometry

Ch. Taudt, T. Baselt, B. Nelsen, H. Assmann, A. Greiner, E. Koch, P. Hartmann

Proceedings Volume 10110, 1011015 (2017) https://doi.org/10.1117/12.2252375

KEYWORDS: Interferometers, Interferometry, Semiconductors, Microelectromechanical systems, Temperature metrology, Optics manufacturing, Light sources, Spectroscopy, Silicon, Calibration

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Proceedings Article | 3 May 2016 Paper

Two-dimensional low-coherence interferometry for the characterization of nanometer wafer topographies

Ch. Taudt, T. Baselt, B. Nelsen, H. Aßmann, A. Greiner, E. Koch, P. Hartmann

Proceedings Volume 9890, 98900R (2016) https://doi.org/10.1117/12.2227887

KEYWORDS: Metrology, Supercontinuum sources, Interferometry, Semiconducting wafers, Thin films, Data acquisition, Interferometers, Semiconductors, Sensors, Spectroscopy, Microelectromechanical systems, Spectral calibration, Calibration, Silicon

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Proceedings Article | 16 March 2016 Paper

Measurement of surface topographies in the nm-range for power chip technologies by a modified low-coherence interferometer

Ch. Taudt, T. Baselt, B. Nelsen, H. Aßmann, A. Greiner, E. Koch, P. Hartmann

Proceedings Volume 9754, 97540H (2016) https://doi.org/10.1117/12.2212913

KEYWORDS: Interferometry, Interferometers, Manufacturing, Semiconducting wafers, Semiconductors, Silicon, Spectroscopy, Light sources, Calibration, Metrology

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Proceedings Article | 15 March 2016 Paper

Analysis of design for Hartmann-Shack measurements under usage of Fourier-iteration and Zernike approximation wavefront reconstruction methods

Alexander Kabardiadi, Andreas Greiner, Heiko Assmann, Tobias Baselt, Peter Hartmann

Proceedings Volume 9717, 97171P (2016) https://doi.org/10.1117/12.2212784

KEYWORDS: Wavefronts, Wavefront reconstruction, Monte Carlo methods, Error analysis, Wavefront sensors, Wavefront analysis, Reconstruction algorithms, Condition numbers, Wave propagation, Spatial resolution, Applied sciences

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Proceedings Article | 4 September 2015 Paper

Fast alternative method for measuring the wavefront of lithography exposure systems

Alexander Kabardiadi, Heiko Assmann, Andreas Greiner, Tobias Baselt, Christopher Taudt, Peter Hartmann

Proceedings Volume 9661, 96610J (2015) https://doi.org/10.1117/12.2195334

KEYWORDS: Wavefronts, Lithography, Spatial resolution, Prototyping, Sensors, Optical testing, Wavefront sensors, Zernike polynomials, Condition numbers, Statistical analysis

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Proceedings Article | 21 May 2015 Paper

Characterization of a dispersion-controlled approach to surface profilometry on wafers using a white-light interferometer

Ch. Taudt, A. Augenstein, T. Baselt, H. Assmann, A. Greiner, E. Koch, P. Hartmann

Proceedings Volume 9517, 95170W (2015) https://doi.org/10.1117/12.2179022

KEYWORDS: Interferometers, Semiconducting wafers, Signal analysis, Spectroscopy, Error analysis, Mirrors, Interferometry, Data modeling, Manufacturing, Spatial resolution

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Proceedings Article | 26 March 2015 Paper

Rigorous wafer topography simulation for investigating wafer alignment quality and robustness

Nicoló Morgana, Dmitrii Gavrilin, Andreas Greiner, Detlef Hofmann, Itaru Kamohara, Ulrich Klostermann, Holger Moeller, Juergen Preuninger

Proceedings Volume 9426, 94260S (2015) https://doi.org/10.1117/12.2086075

KEYWORDS: Optical alignment, Semiconducting wafers, Signal processing, Silicon, Oxides, Computer simulations, Manufacturing, Visualization, Metals, Etching

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Proceedings Article | 4 March 2010 Paper

Methods and challenges to extend existing dry 193nm medium NA lithography beyond 90nm

Jens Schneider, Andreas Greiner, ChinTeong Lim, Vlad Temchenko, Felix Braun, Dieter Kaiser, Tarja Hauck, Ingo Meusel, Dietrich Burmeister, Stephan Loehr, Susanne Volkland, Astrid Bauch, Hendrik Kirbach, Daniel Sarlette, Katrin Thiede

Proceedings Volume 7640, 76403G (2010) https://doi.org/10.1117/12.848207

KEYWORDS: Resolution enhancement technologies, Lithography, Optical proximity correction, Semiconducting wafers, Image processing, 193nm lithography, Chemical reactions, Scanners, Etching, Design for manufacturing

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Proceedings Article | 16 August 2002 Paper

Environmental monitoring system

Gernot Goedl, Dirk Loeffelmacher, Timo Wandel, Gisbert Gralla, Andreas Greiner

Proceedings Volume 4764, (2002) https://doi.org/10.1117/12.479345

KEYWORDS: Magnetism, Environmental monitoring, Power supplies, Sensors, Data storage, Optical lithography, Electromagnetism, Photomasks, Data processing, Vibrometry

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Showing 5 of 10 publications

Conference Committee Involvement (2)

Optical and EUV Nanolithography XXXVIII

23 February 2025 | San Jose, California, United States

Optical and EUV Nanolithography XXXVII

26 February 2024 | San Jose, California, United States

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