Today's telecommunication market is characterized by conservative business practices: tight management of costs, low risk investing and incremental upgrades, rather than the more freewheeling approach taken a few years ago. Optimizing optical components for the current and near term market involves substantial integration, but within particular bounds. The emphasis on evolution, in particular, has led to increased standardization of functions and so created extensive opportunities for integrated product offerings. The same standardization that enables commercially successful integrated functions also changes the competitive environment, and changes the emphasis for component development; shifting the innovation priority from raw performance to delivering the most effective integrated products. This paper will discuss, with specific examples from our transmitter, receiver and passives product families, our understanding of the issues based on extensive experience in delivering high end integrated products to the market, and the direction it drives optical components.
A key attribute emerging in the optoelectronic component supply industry is the ability to deliver 'solution level' products rather than discrete optical components to equipment manufacturers. This approach is primarily aimed at reducing cost for the equipment manufacturer both in engineering and assembly. Such 'solutions' must be designed to be cost effective - offering costs substantially below discrete components - and must be compatible with subcontract
board manufacture without the traditional and expensive skills of fibre handling, splicing and management.
Examples of 'solutions' in this context may be the core of a multifunctional OADM or a DWDM laser transmitter subsystem, with modulation, wavelength and power management all included in a simple to use module. Essential to the cost effective production of such solutions is a high degree of optical/optoelectronic integration. Co-packaging of discrete components and electronics into modules will not deliver the cost reduction demanded. At Bookham Technology we have brought together what we believe to be the three key integration technologies - InP for monolithic tunable sources, GaAs for high performance integrated modulation and ASOC for smart passives and hybrid platforms - which can deliver this cost reduction, together with performance enhancement, over a wide range of applications. In the paper we will demonstrate and compare our above integration approaches with the competing alternatives and seek to show how the power of integration is finally being harnessed in optoelectronics, delivering radical cost reduction as well as enabling system concepts virtually impossible to achieve with discrete components. In the paper we will demonstrate and compare our above integration approaches with the competing alternatives and seek to show how the power of integration is finally being harnessed in optoelectronics, delivering radical cost reduction as well as enabling system concepts virtually impossible to achieve with discrete components.
Recent advances in semiconductor laser technology, which have led to compact sources potentially suitable for lidar, are described. Quantum well technology has enabled InGaAs laser arrays to provide powers of 800 mW in the 900 - 1000 nm wavelength region while InGaAsP lasers provide peak powers of 1.4 W at the eye safe wavelength of 1.55 micrometers . A distributed feedback structure has been used to simultaneously produce a mean power of 100 mW and a linewidth of 800 kHz which may be used for coherent lidar (e.g., FM cw).
A variety of high-speed components for analog applications (lasers, external modulators, photodetectors, and receivers) is described. Particular attention is given to an analog video distribution system based on subcarrier multiplexing techniques, and a phased array antenna control system with all-optical modulation control and phase/amplitude control of the antenna elements.
Conference Committee Involvement (1)
Workshop on Photonic Components for Broadband Communication