Dr. Andrew W. Metz
Sr. Process Engineer at TEL Technology Ctr America LLC
SPIE Involvement:
Author
Publications (20)

SPIE Journal Paper | July 31, 2018
JM3 Vol. 18 Issue 01
KEYWORDS: Etching, Extreme ultraviolet, Line edge roughness, Optical lithography, Line width roughness, Silicon, Double patterning technology, Dielectrics, Metals, System on a chip

PROCEEDINGS ARTICLE | April 17, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Carbon, Lithography, Etching, Chemistry, Scanning electron microscopy, Photoresist materials, Line width roughness, Plasma enhanced chemical vapor deposition, Extreme ultraviolet lithography, Line edge roughness

PROCEEDINGS ARTICLE | April 4, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Optical lithography, Etching, Metals, Image processing, Dielectrics, Silicon, Extreme ultraviolet, Line width roughness, Double patterning technology, Line edge roughness

PROCEEDINGS ARTICLE | March 28, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Oxides, Lithography, Etching, Metals, Dielectrics, Scanning electron microscopy, Directed self assembly, Critical dimension metrology, Tin, Back end of line

PROCEEDINGS ARTICLE | April 27, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Optical lithography, Etching, Ecosystems, Process control, Extreme ultraviolet, Line width roughness, Plasma etching, Line edge roughness, Photoresist processing, Plasma

PROCEEDINGS ARTICLE | April 26, 2017
Proc. SPIE. 10147, Optical Microlithography XXX
KEYWORDS: Lithography, Logic, Optical lithography, Etching, Metals, Control systems, Computer simulations, Photomasks, Extreme ultraviolet, Semiconducting wafers, TCAD, Back end of line, Front end of line

Showing 5 of 20 publications
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