Dr. Andrew R. Romano Profile

Dr. Andrew R. Romano

Worldwide Technical Marketing Manager at Lam Research Corp

SPIE Involvement:

Author

Publications (23)

Proceedings Article | 2 April 2007 Paper

Paper

Second-generation radiation sensitive developable bottom anti-reflective coatings (DBARC) and implant resists approaches for 193-nm lithography

Francis Houlihan, Alberto Dioses, Medhat Toukhy, Andrew Romano, Joseph Oberlander, HengPeng Wu, Salem Mullen, Alexandra Krawicz, PingHung Lu, Mark Neisser

Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV

KEYWORDS: Arsenic, Resistance, Fluorine, Polymers, Prototyping, Lithography, Photoresist processing, Semiconducting wafers, Fourier transforms, Bottom antireflective coatings

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Proceedings Article | 11 April 2006 Paper

Paper

Performance of a dry 193nm resist under wet conditions

Munirathna Padmanaban, Andrew Romano, Guanyang Lin, Simon Chiu, Allen Timko, Frank Houlihan, Dalil Rahman, S. Chakrapani, T. Kudo, Ralph Dammel, Karen Turnquest, Georgia Rich, Scott Schuetter, Timothy Shedd, Gregory Nellis

Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII

KEYWORDS: Thin film coatings, Lithography, Polymers, Line edge roughness, Semiconducting wafers, Photoresist processing, Line width roughness, Immersion lithography, Photoresist materials, Fourier transforms

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Proceedings Article | 29 March 2006 Paper

Paper

Study of the effect of amine additives on LWR and LER

Francis Houlihan, David Rentkiewicz, Guanyang Lin, Dalil Rahman, Douglas Mackenzie, Allen Timko, Takanori Kudo, Clement Anyadiegwu, Muthiah Thiyagarajan, Simon Chiu, Andrew Romano, Ralph Dammel, Munirathna Padmanaban

Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII

KEYWORDS: Line edge roughness, Line width roughness, Polymers, Semiconducting wafers, Lithography, Transistors, Diffusion, Photoresist processing, Critical dimension metrology, Control systems

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SPIE Journal Paper | 1 October 2005

Surface roughness investigation of 157- and 193-nm polymer platforms using different etch conditions

Christoph Hohle, Nicole Heckmann, Michael Sebald, Matthias Markert, Nickolay Stepanenko, Francis Houlihan, Andrew Romano, Raj Sakamuri, David Rentkiewicz, Ralph Dammel

JM3 Vol. 4 Issue 04

KEYWORDS: Etching, Polymers, Surface roughness, Fluorine, Plasmas, Scanning electron microscopy, Resistance, Oxides, Plasma etching, Chlorine

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Proceedings Article | 4 May 2005 Paper

Paper

Study of 157 nm resists with full field exposure tools

Yayi Wei, Nickolay Stepanenko, Michael Sebald, Christoph Hohle, Francis Houlihan, Raj Sakamuri, Alla Dimerli, Andrew Romano, Ralph Dammel

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Thin film coatings, Coating, Binary data, Photomasks, Lithography, Phase shifts, Semiconducting wafers, Contamination, Deep ultraviolet, Absorbance

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Proceedings Article | 4 May 2005 Paper

Paper

Study of barrier coats for protection against airborne contamination in 157-nm lithography

Francis Houlihan, Raj Sakamuri, Keino Hamilton, Alla Dimerli, David Rentkiewicz, Andrew Romano, Ralph Dammel, Yayi Wei, Nickolay Stepanenko, Michael Sebald, Christoph Hohle, Will Conley, Daniel Miller, Toshiro Itani, Masato Shigematsu, Etsuro Kawaguchi

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Thin film coatings, Coating, Contamination, Scanning electron microscopy, Semiconducting wafers, Binary data, Photomasks, Lithography, Deep ultraviolet, Phase shifts

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Proceedings Article | 4 May 2005 Paper

Paper

193nm dual layer organic BARCs for high NA immersion lithography

David Abdallah, Mark Neisser, Ralph Dammel, Georg Pawlowski, S. Ding, Francis Houlihan, Andrew Romano, J. Biafore, Alex Raub

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Fourier transforms, Reflectivity, Lithography, Etching, Bottom antireflective coatings, Multilayers, Antireflective coatings, Semiconducting wafers, Stereolithography, 193nm lithography

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Proceedings Article | 4 May 2005 Paper

Paper

Resist component leaching in 193-nm immersion lithography

Ralph Dammel, Georg Pawlowski, Andrew Romano, Frank Houlihan, Woo-Kyu Kim, Raj Sakamuri, David Abdallah

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Photoresist materials, Semiconducting wafers, Immersion lithography, Systems modeling, Lithography, Interfaces, Diffusion, Photoresist developing, Coating, Data modeling

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Proceedings Article | 4 May 2005 Paper

Paper

Understanding the photoresist surface-liquid interface for ArF immersion lithography

Will Conley, Robert LeSuer, Frank Fan, Allen Bard, Chris Taylor, Pavlos Tsiartas, Grant Willson, Andrew Romano, Ralph Dammel

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Photoresist materials, Semiconducting wafers, Scintillation, Liquids, Water, Immersion lithography, Polymers, Interfaces, Signal detection, Fluorine

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Proceedings Article | 4 May 2005 Paper

Paper

Study of barrier coats for application in immersion 193-nm lithography

Francis Houlihan, Wookyu Kim, Raj Sakamuri, Keino Hamilton, Alla Dimerli, David Abdallah, Andrew Romano, Ralph Dammel, Georg Pawlowski, Alex Raub, Steve Brueck

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Thin film coatings, Lithography, Immersion lithography, Interferometry, Semiconducting wafers, Water, Refractive index, Contamination, Doping, Lithium

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Proceedings Article | 28 May 2004 Paper

Paper

Deep-UV immersion interferometric lithography

Alex Raub, Andrew Frauenglass, Steven Brueck, Will Conley, Ralph Dammel, Andy Romano, Mitsuru Sato, William Hinsberg

Proc. SPIE. 5377, Optical Microlithography XVII

KEYWORDS: Liquids, Polymers, Lithography, Water, Coating, Immersion lithography, Interferometry, Picosecond phenomena, Prisms, Refractive index

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Proceedings Article | 14 May 2004 Paper

Paper

Recent advances in fluorinated resists for application at 157 nm

Francis Houlihan, Raj Sakamuri, Andrew Romano, David Rentkiewicz, Ralph Dammel, Willard Conley, Daniel Miller, Michael Sebald, Nickolay Stepanenko, Matthias Markert, Uta Mierau, Inge Vermeir, Christoph Hohle, Toshiro Itani, Masato Shigematsu, Etsurou Kawaguchi

Proc. SPIE. 5376, Advances in Resist Technology and Processing XXI

KEYWORDS: Transparency, Etching, Absorbance, Photomasks, Lithography, Resistance, Pellicles, Binary data, Silicon, Polymers

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Proceedings Article | 12 June 2003 Paper

Paper

Evaluation of novel fluorinated resist matrices for 157-nm lithography

Francis Houlihan, Andrew Romano, David Rentkiewicz, Raj Sakamuri, Ralph Dammel, Will Conley, Georgia Rich, Daniel Miller, Larry Rhodes, Joseph McDaniels, Chun Chang

Proc. SPIE. 5039, Advances in Resist Technology and Processing XX

KEYWORDS: Etching, Rutherfordium, Polymers, Absorbance, Lithography, Fluorine, Resistance, Oxides, Transparency, Plasma etching

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Proceedings Article | 12 June 2003 Paper

Paper

Baking study of fluorinated 157-nm resist

Francis Houlihan, Raj Sakamuri, Andrew Romano, Ralph Dammel, Will Conley, Georgia Rich, Daniel Miller, Larry Rhodes, Joseph McDaniels, Chun Chang

Proc. SPIE. 5039, Advances in Resist Technology and Processing XX

KEYWORDS: Diffusion, Temperature metrology, Rutherfordium, Binary data, Annealing, Lithography, Chemically amplified resists, Image quality, Plasma etching, Resistance

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Proceedings Article | 24 July 2002 Paper

Paper

Negative photoresist for 157-nm microlithography; a progress report

Will Conley, Brian Trinque, Daniel Miller, Paul Zimmerman, Takanori Kudo, Ralph Dammel, Andrew Romano, C. Grant Willson

Proc. SPIE. 4690, Advances in Resist Technology and Processing XIX

KEYWORDS: Photoresist materials, Polymers, Absorbance, Semiconducting wafers, Spectroscopy, Transparency, Photomasks, Silicon, FT-IR spectroscopy, Optical lithography

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Proceedings Article | 24 July 2002 Paper

Paper

Cycloolefin/cyanoacrylate (COCA) copolymers for 193-nm and 157-nm lithography

Ralph Dammel, Raj Sakamuri, Sang-Ho Lee, Dalil Rahman, Takanori Kudo, Andrew Romano, Larry Rhodes, John-Henry Lipian, Cheryl Hacker, Dennis Barnes

Proc. SPIE. 4690, Advances in Resist Technology and Processing XIX

KEYWORDS: Polymers, Lithography, Absorbance, Photoresist materials, Polymerization, Transparency, Glasses, Binary data, Photomasks, Dry etching

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Proceedings Article | 24 July 2002 Paper

Paper

Illumination, acid diffusion, and process optimization considerations for 193-nm contact hole resists

Takanori Kudo, Eric Alemy, Ralph Dammel, Woo-Kyu Kim, Sang-Ho Lee, Seiya Masuda, Douglas McKenzie, Dalil Rahman, Andrew Romano, Munirathna Padmanaban, Jun-Sung Chun, Jae Chang Jung, Sung-Koo Lee, Ki-Soo Shin, Hyeong-Soo Kim

Proc. SPIE. 4690, Advances in Resist Technology and Processing XIX

KEYWORDS: Photomasks, Polymers, Lithography, Binary data, Diffusion, Scanning electron microscopy, Halftones, Photoresist processing, Coherence (optics), Monochromatic aberrations

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Proceedings Article | 24 July 2002 Paper

Paper

Dissolution inhibitors for 157-nm microlithography

Will Conley, Daniel Miller, Charles Chambers, Brian Osborn, Raymond Hung, Hoang Tran, Brian Trinque, Matthew Pinnow, Takashi Chiba, Scott McDonald, Paul Zimmerman, Ralph Dammel, Andrew Romano, C. Grant Willson

Proc. SPIE. 4690, Advances in Resist Technology and Processing XIX

KEYWORDS: Polymers, Absorbance, Photoresist materials, Imaging systems, Lithography, Semiconducting wafers, Transparency, Optical lithography, Vacuum ultraviolet, Phase measurement

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Proceedings Article | 24 August 2001 Paper

Paper

Transparent resins for 157-nm lithography

Ralph Dammel, Raj Sakamuri, Andrew Romano, Richard Vicari, Cheryl Hacker, Will Conley, Daniel Miller

Proc. SPIE. 4345, Advances in Resist Technology and Processing XVIII

KEYWORDS: Polymers, Etching, Absorbance, Lithography, Dry etching, Photoresist materials, Fluorine, Absorption, Transparency, Photomasks

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Proceedings Article | 24 August 2001 Paper

Paper

Toward 0.1-um contact hole process by using water-soluble organic overcoating material (WASOOM)-- Resist flow technology III: study on WASOOM, top flare, and etch characterization

Jun-Sung Chun, Chang Maeng, Mark Tesauro, John Sturtevant, Joseph Oberlander, Andrew Romano, John Sagan, Ralph Dammel

Proc. SPIE. 4345, Advances in Resist Technology and Processing XVIII

KEYWORDS: Etching, Chemistry, Polymers, Photoresist materials, Semiconducting wafers, Plasma etching, Oxides, Photoresist processing, Contamination, Plasma

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Proceedings Article | 22 August 2001 Paper

Paper

193-nm photoresist shrinkage after electron-beam exposure

Bo Su, Guy Eytan, Andrew Romano

Proc. SPIE. 4344, Metrology, Inspection, and Process Control for Microlithography XV

KEYWORDS: Scanning electron microscopy, Electron beams, Lithography, 3D metrology, Line edge roughness, Polymers, 3D image processing, Imaging technologies, Semiconducting wafers, Photoresist materials

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Proceedings Article | 27 April 1999 Paper

Paper

Physically based model for predicting volume shrinkage in chemically amplified resists

Nickhil Jakatdar, Junwei Bao, Costas Spanos, Ramkumar Subramanian, Bharath Rangarajan, Andrew Romano

Proc. SPIE. 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing

KEYWORDS: Data modeling, Chemically amplified resists, Photoresist processing, Systems modeling, Polymers, Process modeling, Lithography, Molecules, Interfaces, Computing systems

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Proceedings Article | 8 June 1998 Paper

Paper

Characterization of a positive chemically amplified photoresist for process control

Nickhil Jakatdar, Xinhui Niu, Costas Spanos, Andrew Romano, Joseph Bendik, Ronald Kovacs, Stephen Hill

Proc. SPIE. 3332, Metrology, Inspection, and Process Control for Microlithography XII

KEYWORDS: Semiconducting wafers, Photoresist materials, FT-IR spectroscopy, Deep ultraviolet, Process control, Chemically amplified resists, Polymers, Ions, Absorption, Semiconductors

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Showing 5 of 23 publications

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