Anna Dedkova
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 31 January 2022 Paper
Proceedings Volume 12157, 121571K (2022) https://doi.org/10.1117/12.2623908
KEYWORDS: Surface properties, Surface roughness, 3D surface sensing, Nanotechnology, Semiconducting wafers, Microelectronics, Silicon, Shape analysis, Data modeling, Visualization, Thin films, Mathematical modeling

Proceedings Article | 31 January 2022 Paper
N. Djuzhev, M. Makhiboroda, E. Gusev, M. Fomichev, A. Dedkova, P. Ivanin
Proceedings Volume 12157, 1215712 (2022) https://doi.org/10.1117/12.2623584
KEYWORDS: Semiconducting wafers, Wafer bonding, Silicon, Packaging, Adhesives, Manufacturing, Glasses, Standards development, Lithography, Transistors

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