Dr. Anthony Yen
VP and Head of Technology Development Centers at
SPIE Involvement:
Awards Committee | Nominating Committee | Symposia Committee | Fellow status | Conference Program Committee | Symposium Committee | Conference Chair | Symposium Chair | Author
Area of Expertise:
Nanometer Patterning , Classical Optics , Semiconductor Physics , Semiconductor Technology Strategy
Profile Summary

Anthony (Tony) Yen is vice president and head of ASML’s Technology Development Center. From 2006 to 2017, he was with TSMC where he led the development of EUV lithography, including its mask technology, for high-volume manufacturing. The joint TSMC-ASML “One Team” realized, for the first time in the field, an EUV power of 90W in the fall of 2014 and a throughput of 500 average wafers per day for 4 consecutive weeks in the summer of 2015. From 1991 to 1997, as a researcher with Texas Instruments, he worked on various techniques to enhance the practical resolution of microlithography. From 1997 to 2003, he was with TSMC where he first led the development of lithography processes for TSMC's 0.25, 0.18, 0.15, and 0.13 micron generations of logic integrated circuits and then co-led infrastructure development for next-generation lithography technologies at SEMATECH. From 2003 to 2006 he was with Cymer where he headed its marketing organization. Tony received his BSEE degree from Purdue University and his SM, EE, PhD, and MBA degrees from MIT. He is a Fellow of SPIE and IEEE, and a 2018 recipient of Outstanding Electrical ad Computer Enginneer award from Purdue University School of Electrical and Computer Engineering.
Publications (58)


SPIE Journal Paper | January 1, 2017
MGSP Vol. 12 Issue 01

PROCEEDINGS ARTICLE | June 16, 2016
Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII
KEYWORDS: Wafer-level optics, Lithography, Mirrors, Optical lithography, Manufacturing, Photomasks, Extreme ultraviolet, Excimer lasers, Extreme ultraviolet lithography, Semiconducting wafers

SPIE Journal Paper | June 3, 2016
JM3 Vol. 15 Issue 02
KEYWORDS: Photomasks, Image registration, Mask making, Palladium, Monte Carlo methods, Quartz, Model-based design, Scattering, Electron beam lithography, Holmium

PROCEEDINGS ARTICLE | May 10, 2016
Proc. SPIE. 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Modeling, Lithography, Metrology, Atomic force microscopy, Scanning electron microscopy, Transmission electron microscopy, Photomasks, Critical dimension metrology, Semiconducting wafers, Phase shifts

PROCEEDINGS ARTICLE | December 18, 2015
Proc. SPIE. 9635, Photomask Technology 2015
KEYWORDS: Quartz, Particles, Inspection, Chromium, Digital watermarking, Oxygen, Photomasks, Extreme ultraviolet, Ruthenium, Plasma

Showing 5 of 58 publications
Conference Committee Involvement (28)
Advanced Etch Technology for Nanopatterning VIII
25 February 2019 | San Jose, California, United States
Advanced Etch Technology for Nanopatterning VII
26 February 2018 | San Jose, California, United States
Advanced Etch Technology for Nanopatterning VI
27 February 2017 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography VIII
27 February 2017 | San Jose, California, United States
Advanced Etch Technology for Nanopatterning V
22 February 2016 | San Jose, California, United States
Showing 5 of 28 published special sections
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