Dr. Anuja De Silva Profile

Dr. Anuja De Silva

Advanced Patterning Research at IBM Corp

SPIE Involvement:

Conference Program Committee | Author

Publications (32)

SPIE Journal Paper | July 31, 2018

Inorganic hardmask development for extreme ultraviolet patterning

De Silva, Anuja , Dutta, Ashim , Meli, Luciana , Yao, Yiping , Mignot, Yann , Guo, Jing , Felix, Nelson

JM3 Vol. 18 Issue 01

KEYWORDS: Etching, Optical lithography, Extreme ultraviolet, Head-mounted displays, Silicon, Chemistry, Amorphous silicon, Argon, Polymers, Interfaces

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PROCEEDINGS ARTICLE | April 9, 2018

Polymer brush as adhesion promoter for EUV patterning

Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV

KEYWORDS: Optical lithography, Etching, Polymers, Dielectrics, Chemistry, Printing, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers

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PROCEEDINGS ARTICLE | March 28, 2018

Defect detection strategies and process partitioning for SE EUV patterning

Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX

KEYWORDS: Electron beam lithography, Defect detection, Modulation, Etching, Coating, Inspection, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers, Stochastic processes

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PROCEEDINGS ARTICLE | March 19, 2018

Inorganic hardmask development for EUV patterning

Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX

KEYWORDS: Amorphous silicon, Optical lithography, Etching, Argon, Polymers, Interfaces, Silicon, Chemistry, Extreme ultraviolet, Head-mounted displays

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PROCEEDINGS ARTICLE | October 16, 2017

Coater/developer based techniques to improve high-resolution EUV patterning defectivity

Proc. SPIE. 10450, International Conference on Extreme Ultraviolet Lithography 2017

KEYWORDS: Optical lithography, Contamination, Coating, Manufacturing, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography

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PROCEEDINGS ARTICLE | October 16, 2017

Development of amorphous silicon based EUV hardmasks through physical vapor deposition

Proc. SPIE. 10450, International Conference on Extreme Ultraviolet Lithography 2017

KEYWORDS: Amorphous silicon, Optical lithography, Etching, Silicon, Chemical vapor deposition, Photoresist materials, Silicon films, Extreme ultraviolet, Physical vapor deposition, Head-mounted displays

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SPIE Journal Paper | August 28, 2017

Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer

Seshadri, Indira , De Silva, Anuja , Meli, Luciana , Liu, Chi-Chun Charlie , Chi, Cheng , Guo, Jing , Truong, Hoa , Schmidt, Kristin , Arnold, John , Felix, Nelson , Singh, Lovejeet , Furukawa, Tsuyoshi , Ayothi, Ramakrishnan , Raley, Angelique , Farrell, Richard

JM3 Vol. 16 Issue 03

KEYWORDS: Oxides, Polymers, Extreme ultraviolet, Optical lithography, Head-mounted displays, Etching, Atomic layer deposition, Chemistry, Plasma enhanced chemical vapor deposition, Printing

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SPIE Journal Paper | May 23, 2017

Development of TiO₂ containing hardmasks through plasma-enhanced atomic layer deposition

De Silva, Anuja , Seshadri, Indira , Chung, Kisup , Arceo, Abraham , Meli, Luciana , Mendoza, Brock , Sulehria, Yasir , Yao, Yiping , Sunder, Madhana , Truong, Hoa , Matham, Shravan , Bao, Ruqiang , Wu, Heng , Felix, Nelson , Kanakasabapathy, Sivananda

JM3 Vol. 16 Issue 02

KEYWORDS: Titanium dioxide, Metals, Atomic layer deposition, Optical lithography, Etching, Dry etching, Contamination, Modulation, Wet etching, Lithography

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PROCEEDINGS ARTICLE | March 28, 2017

Driving down defect density in composite EUV patterning film stacks

Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII

KEYWORDS: Optical lithography, Defect detection, Air contamination, Composites, Coating, Manufacturing, Inspection, Laser scattering, Scanning electron microscopy, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers

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PROCEEDINGS ARTICLE | March 27, 2017

DSA patterning options for logics and memory applications

Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV

KEYWORDS: Lithography, Logic, Optical lithography, Etching, Metals, Silicon, Manufacturing, Extreme ultraviolet, Directed self assembly, Plasma etching, Optical alignment, Critical dimension metrology, Line edge roughness, Nanofabrication

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PROCEEDINGS ARTICLE | March 27, 2017

Fundamentals of EUV resist-inorganic hardmask interactions

Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV

KEYWORDS: Oxides, Etching, Interfaces, Silicon, Materials processing, Image resolution, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Head-mounted displays, Photoresist processing, Semiconducting wafers, Systems modeling

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PROCEEDINGS ARTICLE | March 27, 2017

Development of TiO2 containing hardmasks through PEALD deposition

Proc. SPIE. 10146, Advances in Patterning Materials and Processes XXXIV

KEYWORDS: Carbon, Lithography, Titanium, Optical lithography, Titanium dioxide, Etching, Dry etching, Metals, Photoresist materials, Wet etching, Plasma

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PROCEEDINGS ARTICLE | March 24, 2017

Single-expose patterning development for EUV lithography

Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII

KEYWORDS: Lithography, Optical lithography, Etching, Metals, Interfaces, Silicon, Quantum efficiency, Materials processing, Photoresist materials, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist processing

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PROCEEDINGS ARTICLE | March 24, 2017

Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer

Proc. SPIE. 10143, Extreme Ultraviolet (EUV) Lithography VIII

KEYWORDS: Oxides, Lithography, Optical lithography, Etching, Polymers, Chemistry, Photoresist materials, Atomic layer deposition, Extreme ultraviolet, Extreme ultraviolet lithography, Head-mounted displays, Photoresist processing, Back end of line

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PROCEEDINGS ARTICLE | April 4, 2016

DSA via hole shrink for advanced node applications

Proc. SPIE. 9777, Alternative Lithographic Technologies VIII

KEYWORDS: Lithography, Optical lithography, Polymethylmethacrylate, Etching, Extreme ultraviolet, Directed self assembly, Picosecond phenomena, Critical dimension metrology, Semiconducting wafers, Global Positioning System

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PROCEEDINGS ARTICLE | March 18, 2016

EUV patterning successes and frontiers

Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII

KEYWORDS: Oxides, Lithography, Optical lithography, Etching, Ions, Extreme ultraviolet, Extreme ultraviolet lithography, Neodymium

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PROCEEDINGS ARTICLE | March 27, 2014

Spin-on organic hardmask for topo-patterned substrate

Proc. SPIE. 9051, Advances in Patterning Materials and Processes XXXI

KEYWORDS: Carbon, Lithography, Optical lithography, Glasses, Resistance, Fourier transforms, Chemical vapor deposition, Photoresist materials, Photomasks

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PROCEEDINGS ARTICLE | September 9, 2013

Under-layer effects for block levels: are they under control?

Proc. SPIE. 8880, Photomask Technology 2013

KEYWORDS: Optical lithography, Data modeling, Etching, Silicon, Reflectivity, Computational lithography, Optical proximity correction, Critical dimension metrology, Semiconducting wafers, Near field optics

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PROCEEDINGS ARTICLE | March 20, 2012

Investigation of pattern wiggling for spin-on organic hardmask materials

Proc. SPIE. 8325, Advances in Resist Materials and Processing Technology XXIX

KEYWORDS: Optical lithography, Etching, Hydrogen, Resistance, Fourier transforms, Chemical vapor deposition, Extreme ultraviolet, Double patterning technology, Critical dimension metrology, Fluorine

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PROCEEDINGS ARTICLE | April 16, 2011

Hexafluoroalcohol (HFA) containing molecular resist materials for high-resolution lithographic applications

Proc. SPIE. 7972, Advances in Resist Materials and Processing Technology XXVIII

KEYWORDS: Thin films, Lithography, Electron beam lithography, Magnesium, Polymers, Glasses, Molecules, Silicon, Extreme ultraviolet, Extreme ultraviolet lithography

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PROCEEDINGS ARTICLE | April 16, 2011

Systematic studies on reactive ion etch-induced deformations of organic underlayers

Proc. SPIE. 7972, Advances in Resist Materials and Processing Technology XXVIII

KEYWORDS: Oxides, Electron beam lithography, Etching, Ions, Silicon, Gases, Hydrogen, Plasma etching, Reactive ion etching, Plasma

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PROCEEDINGS ARTICLE | April 3, 2010

Direct write 3-dimensional nanopatterning using probes

Proc. SPIE. 7637, Alternative Lithographic Technologies II

KEYWORDS: Lithography, Nanostructures, Electron beam lithography, Optical lithography, Sensors, Etching, Glasses, Molecules, Silicon, Reactive ion etching

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PROCEEDINGS ARTICLE | April 1, 2009

Quantitative measurement of the molecular-mass distribution in calix[4]resorcinarene molecular glass resists by mass spectrometry

Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI

KEYWORDS: Calibration, Polymers, Glasses, Molecules, Ions, Mass spectrometry, Photoresist materials, Ionization, Molecular spectroscopy, Molecular lasers

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PROCEEDINGS ARTICLE | April 1, 2009

Molecular glass resists for next-generation lithography

Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI

KEYWORDS: Lithography, Magnesium, Etching, Polymers, Glasses, Molecules, Resistance, Photoresist materials, Boron, 193nm lithography

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PROCEEDINGS ARTICLE | April 15, 2008

A comparison of the reaction-diffusion kinetics between model-EUV polymer and molecular-glass photoresists