Dr. Ariel Ben-Porath
Product Unit Head at Applied Materials
SPIE Involvement:
Conference Program Committee | Author
Publications (5)

PROCEEDINGS ARTICLE | May 10, 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Reticles, Metrology, Data modeling, Calibration, Scanning electron microscopy, Photomasks, Optical proximity correction, Computer aided design, Semiconducting wafers, Resolution enhancement technologies

PROCEEDINGS ARTICLE | April 29, 2004
Proc. SPIE. 5378, Data Analysis and Modeling for Process Control
KEYWORDS: Sensors, Image segmentation, Particles, Electrons, Reflectivity, 3D modeling, Scanning electron microscopy, 3D vision, 3D image processing, Diffusion tensor imaging

PROCEEDINGS ARTICLE | July 12, 2002
Proc. SPIE. 4692, Design, Process Integration, and Characterization for Microelectronics
KEYWORDS: Contamination, Etching, Metals, Manufacturing, Inspection, Scanning electron microscopy, Microelectronics, Semiconducting wafers, Chemical mechanical planarization, Discrete inspection

PROCEEDINGS ARTICLE | June 2, 2000
Proc. SPIE. 3998, Metrology, Inspection, and Process Control for Microlithography XIV
KEYWORDS: Semiconductors, Defect detection, Manufacturing, Inspection, Electron microscopes, Scanning electron microscopy, Neural networks, Very large scale integration, Semiconducting wafers, Classification systems

PROCEEDINGS ARTICLE | June 2, 2000
Proc. SPIE. 3998, Metrology, Inspection, and Process Control for Microlithography XIV
KEYWORDS: Defect detection, Imaging systems, Sensors, Particles, Inspection, Scanning electron microscopy, Semiconducting wafers, Yield improvement, Tin, Chemical mechanical planarization

Conference Committee Involvement (6)
Data Analysis and Modeling for Patterning Control III
23 February 2006 | San Jose, California, United States
Data Analysis and Modeling for Process Control II
3 March 2005 | San Jose, California, United States
Data Analysis and Modeling for Process Control
26 February 2004 | Santa Clara, California, United States
Machine Vision Applications in Industrial Inspection XII
21 January 2004 | San Jose, California, United States
Process and Materials Characterization and Diagnostics in IC Manufacturing II
27 February 2003 | Santa Clara, CA, United States
Showing 5 of 6 published special sections
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