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Arnaud Brulé
at Synova SA
SPIE Involvement:
Author
Publications (2)
Proceedings Article | 22 February 2008 Paper
Saw + LMJ: a hybrid semiconductor dicing solution
Bernold Richerzhagen, Martin Plankensteiner, Notker Kling, Keith Stay, Arnaud Brulé
Proceedings Volume 6880, 688005 (2008) https://doi.org/10.1117/12.760357
KEYWORDS: Semiconducting wafers, Laser cutting, Semiconductors, Head, Semiconductor lasers, Diamond, Silicon, Wafer-level optics, Manufacturing, Wafer dicing
Proceedings Article | 13 February 2007 Paper
Dicing of high-power white LEDs in heat sinks with the water jet-guided laser
Tuan Anh Mai, Roy Housh, Arnaud Brulé, Bernold Richerzhagen
Proceedings Volume 6486, 64860A (2007) https://doi.org/10.1117/12.701059
KEYWORDS: Light emitting diodes, Semiconducting wafers, Laser cutting, Molybdenum, Laser applications, Chemical vapor deposition, Manufacturing, Metals, Contamination, Semiconductors
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