SCD has developed a new 1920x1536 / 10 μm digital Infrared detector for the MWIR window named Blackbird. The
Blackbird detector features a Focal Plane Array (FPA) that incorporates two technological building blocks developed
over the past few years. The first one is a 10 μm InSb pixel based on the matured planar technology. The second building
block is an innovative 10 μm ReadOut Integrated Circuit (ROIC) pixel. The InSb and the ROIC arrays are connected
using Flip-Chip technology by means of indium bumps. The digital ROIC consists a matrix of 1920x1536 pixels and has
an analog to digital (A/D) converter per-channel (total of 1920x2 A/Ds). It allows for full frame readout at a high frame
rate of up to 120 Hz. Such an on-chip A/D conversion eliminates the need for several A/D converters with fairly high
power consumption at the system level. The ROIC power consumption at maximum bandwidth is less than 400 mW. It
features a wide range of pixel-level functionality such as several conversion gain options and a 2x2 pixel binning. The
ROIC design makes use of the advanced and matured CMOS technology, 0.18 μm, which allows for high functionality
and relatively low power consumption. The FPA is mounted on a Cold-Finger by a specially designed ceramic substrate.
The whole assembly is housed in a stiffened Dewar that withstands harsh environmental conditions while minimizing the
environment heat load contribution to the heat load of the detector. The design enables a 3-megapixel detector with
overall low size, weight, and power (SWaP) with respect to comparable large format detectors. In this work we present
in detail the characteristic performance of the new Blackbird detector.