Mr. Axel Feicke Profile

Axel Feicke

Member Technical Staff at Advanced Mask Technology Ctr GmbH Co KG

SPIE Involvement:

Author

Area of Expertise:

Optical & Ebeam lithography , Semiconductor Manufacturing , Coater, bakes, developer , Mask making , Photo resists

Publications (11)

Proceedings Article | 12 October 2021 Presentation + Paper

3D-MC modelling of particle contamination induced defects in ebeam mask writing

Jan Klikovits, Robert Polster, Ulrich Hofmann, Axel Feicke, Timo Wandel

Proceedings Volume 11855, 1185503 (2021) https://doi.org/10.1117/12.2600956

KEYWORDS: Electrons, Copper, Scattering, Monte Carlo methods, Polymethylmethacrylate, Particles, Particle contamination, Photomasks, Electron beam lithography

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Proceedings Article | 28 September 2017 Paper

Half circle chrome loss by electrochemical effects

D. Caspary, S. Jähne, P. Nesladek, M. Kristlib, L. Bahrig, A. Feicke, M. Kaiser, J. Lorbeer, T. Wandel

Proceedings Volume 10446, 104460T (2017) https://doi.org/10.1117/12.2279699

KEYWORDS: Photomasks, Phase shifts, Electrochemical etching

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Proceedings Article | 10 May 2016 Paper

Influence of different developer nozzle types on the photomask performance

Cindy Schmädicke, Axel Feicke, Mark Herrmann, Christian Bürgel

Proceedings Volume 9984, 998403 (2016) https://doi.org/10.1117/12.2240859

KEYWORDS: Photomasks, SRAF, Standards development, Reticles, Critical dimension metrology, Line width roughness, Inspection, Binary data, Scanning electron microscopy, Electronics

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Proceedings Article | 14 October 2011 Paper

More than monitoring: advanced lithographic process tuning

G. R. Cantrell, Jo Alvin Dumaya, Christian Bürgel, Axel Feicke, Martin Häcker, Clemens Utzny

Proceedings Volume 8166, 81660M (2011) https://doi.org/10.1117/12.896416

KEYWORDS: Critical dimension metrology, Photoresist processing, Lithography, Reticles, Principal component analysis, Photomasks, Etching, Cadmium, Statistical analysis, Chemically amplified resists

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Proceedings Article | 25 September 2010 Paper

Using principal component analysis for photomask CD signature investigations

G. R. Cantrell, Christian Bürgel, Axel Feicke, Martin Sczyrba, Clemens Utzny

Proceedings Volume 7823, 78232O (2010) https://doi.org/10.1117/12.864139

KEYWORDS: Critical dimension metrology, Reticles, Principal component analysis, Photoresist processing, Photomasks, Error analysis, Data modeling, Manufacturing, Metrology, Process engineering

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Proceedings Article | 28 June 2005 Paper

Evaluation of e-beam sensitive CARs for advanced mask making

Axel Feicke, Mathias Irmscher, Anatol Schwersenz, Martin Tschinkl

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617111

KEYWORDS: Line edge roughness, Photoresist processing, Etching, Photomasks, Mask making, Scanning electron microscopy, Thin film coatings, Semiconducting wafers, Diffusion, Coating

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Proceedings Article | 28 June 2005 Paper

Application of a wafer development process to mask making

Gaston Lee, Celine Berger, Christian Burgel, Axel Feicke, Rusty Cantrell, Martin Tschinkl

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617104

KEYWORDS: Photomasks, Semiconducting wafers, Forward error correction, Reticles, Manufacturing, Chromium, Control systems, Standards development, Etching, Photoresist processing

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Proceedings Article | 6 December 2004 Paper

First photomask developer based on state-of-the-art wafer processing technology

Peter Tichy, Takahiro Fukai, Shigenori Kamei, Hiroshi Asai, Tatsuhito Kotoda, Kazuhiro Takeshita, Tetsushi Miyamoto, Yoshiki Okamoto, Hideo Funakoshi, Shinji Koga, Shigemi Oono, Rusty Cantrell, Axel Feicke, Wolfram Porsche, Martin Tschinkl, Gaston Lee

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.568820

KEYWORDS: Photomasks, Semiconducting wafers, Photoresist developing, Manufacturing, Critical dimension metrology, Reticles, Control systems, Diffusion, Photoresist processing, Wafer manufacturing

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Proceedings Article | 6 December 2004 Paper

Patterning performance of most recent e-beam-sensitive CARs for advanced mask making: an update

Anatol Schwersenz, Joerg Butschke, Axel Feicke, Mathias Irmscher, Peter Voehringer

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.568819

KEYWORDS: Line edge roughness, Etching, Mask making, Electron beam lithography, Critical dimension metrology, Coating, Photoresist processing, Chemically amplified resists, Scanning electron microscopy, Temperature metrology

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Proceedings Article | 6 December 2004 Paper

Evaluation of a new-generation photomask develop system for CAR

Rusty Cantrell, Martin Tschinkl, Axel Feicke, Wolfram Porsche, Gaston Lee, Tatsuhito Kotoda, Peter Tichy, Takahiro Fukai, Shigenori Kamei, Hiroshi Asai

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.568393

KEYWORDS: Photomasks, Semiconducting wafers, Particles, Deep ultraviolet, Standards development, Lithography, Manufacturing, Photoresist processing, Control systems, Diffractive optical elements

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Proceedings Article | 20 October 2000 Paper

Optimization of the planarizing performance of a DUV organic bottom antireflective coating for via first dual-damascene process: cooperation to achieve material and process characterization

Paul Williams, Alice Martin, Marlene Strobl, William Roberts, Francis Goodwin, Lars Voelkel, Axel Feicke, Sean Trautman, James Lamb

Proceedings Volume 4226, (2000) https://doi.org/10.1117/12.404853

KEYWORDS: Semiconducting wafers, Etching, Manufacturing, Deep ultraviolet, Coating, Metals, Materials processing, Bottom antireflective coatings, Photomasks, Lithography

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Showing 5 of 11 publications

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