This work deals with recent advances in the microfabrication process technology for medium to high-aspect ratio
structures fabricated by UV photolithography using different kinds of photoresists. The resulting structures were used as
molds and will be transformed into metal structures by electroplating. Two types of photoresists are compared: epoxy-based
(negative) SU-8 and acrylate-based (negative) Intervia BPN. This work was prompted by the need to find an
alternative to SU-8 photoresist which is difficult to process and remove after electroplating. The results presented in this
paper open up new possibilities for low-cost processes using electroplating in MEMS applications.