Dr. Bang-Ching Ho
R&D Manager at Nissan Chemical Taiwan Co Ltd
SPIE Involvement:
Conference Program Committee | Author
Publications (22)

Proceedings Article | 1 April 2013
Proc. SPIE. 8679, Extreme Ultraviolet (EUV) Lithography IV
KEYWORDS: Roentgenium, Etching, Silicon, Chromophores, Photomasks, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Photoresist processing, System on a chip

Proceedings Article | 29 March 2013
Proc. SPIE. 8682, Advances in Resist Materials and Processing Technology XXX
KEYWORDS: Lithography, Optical lithography, Contamination, Deep ultraviolet, Chemical species, Transmittance, Extreme ultraviolet, Absorbance, Extreme ultraviolet lithography, Thin film coatings

Proceedings Article | 29 March 2013
Proc. SPIE. 8682, Advances in Resist Materials and Processing Technology XXX
KEYWORDS: Lithography, Etching, Polymers, Image processing, Materials processing, Photomasks, Extreme ultraviolet lithography, Immersion lithography, Photoresist processing, Liquids

Proceedings Article | 28 March 2012
Proc. SPIE. 8325, Advances in Resist Materials and Processing Technology XXIX
KEYWORDS: Lithography, Roentgenium, Silica, Etching, Polymers, Coating, Photomasks, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography

Proceedings Article | 23 March 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Lithography, Contamination, Deep ultraviolet, Optical properties, Transmittance, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Light, Absorption

Proceedings Article | 8 April 2011
Proc. SPIE. 7969, Extreme Ultraviolet (EUV) Lithography II
KEYWORDS: Lithography, Polymers, Interfaces, Diffusion, Coating, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Critical dimension metrology, Line edge roughness

Showing 5 of 22 publications
Conference Committee Involvement (2)
Advances in Resist Technology and Processing XXII
28 February 2005 | San Jose, California, United States
Advances in Resist Technology and Processing XXI
23 February 2004 | Santa Clara, California, United States
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